金刚石与磨料磨具工程2025，Vol.45Issue(2)：224-235,12.DOI:10.13394/j.cnki.jgszz.2023.0266
电镀金刚石线锯用螺旋镀液流和旋转磁场装置的设计与分析
Design and analysis of spiral plating solution flow and rotating magnetic field device for electroplated diamond wire saw
摘要
Abstract
Objectives:In response to the defects of diamond abrasive particle aggregation and large density fluctu-ations on the surface of traditional electroplated diamond wire saws,an innovative design of a combination device of spiral bath flow and rotating magnetic field is proposed to break through the technical bottlenecks of existing electro-plating processes in terms of coating uniformity,orderly arrangement of diamonds and tool life.The research focuses on solving three core problems:(1)the structural design of the spiral bath flow electroplating device and the optimization of flow rate and spiral speed of the spiral bath flow;(2)the structural design of the rotating magnetic field device and the optimization of rotation speed and magnetic field strength;(3)the optimal process parameters for electroplating dia-mond wire saws in the new composite field electroplating device,and the production of wire saws for silicon wafer cut-ting experiments.Methods:The electroplating mixture spirals in the same direction around the baseline,which can im-prove the consistency of diamond particle concentration around the baseline circumference and enhance the uniformity of the mixed solution stirring.Based on this,the spiral bath flow electroplating device is designed.Then the rotating magnetic field device is designed by experiment,and a suitable alternating magnetic field is applied to the plating solu-tion,which is beneficial to improve the deposition rate and the consolidation strength of the diamond particles with the baseline.The spiral bath flow electroplating device and the rotating magnetic field device together form the electroplat-ing combination device.Through the data accumulation of continuous experiments and production practice,the basic parameters such as permanent magnet material,magnet size,inner wall size of the glass tube,baseline travel speed,and bottom diameter of the spiral blade in the combined device are determined.The optimal technological parameters of the electroplated diamond wire saw for the combined device are obtained by the single-factor experiment method,and the wire saw is made.The surface morphologies of electroplated diamond wire saws prepared under different processes are observed by scanning electron microscope,and the monocrystalline silicon is sliced by an ultra-high speed multi-wire cutting machine.The surface roughness of the silicon wafer in the feed direction is measured by a surface roughness tester.Results:The mixed liquid of the spiral bath flow electroplating device enters the glass tube from the spiral blades of the spiral guide inner core,rotates spirally upward around the baseline in the glass tube under the action of the spiral blades,and flows out from the outlet of the mixed solution in the glass tube.Four symmetrical grooves are set on the in-ner wall of the glass tube for placing nickel anodes to avoid hindering the flow of the spiral liquid.The baseline enters from the hollow center of the spiral guide core and passes upward through the electroplating device,and the baseline is not in direct contact with the spiral guide inner core.According to the inner diameter value of the glass tube d=56 mm,the minimum flow rate of the mixed liquid calculated is Q=4.43 L/min.The inner core material of the spiral guide is TA2 titanium alloy,the bottom diameter of the spiral blade is 12 mm,the helix angle is 60°,the thickness is 2 mm,and the outer diameter and the height are consistent with d.The rotating magnetic field device is composed of NdFeB alloy cylinders and a fixed holder,etc.,which rotates precisely around the center line of the spiral bath flow electroplating device at the appropriate rotation speed.The basic parameters of the combined device are:the magnet size is φ20 mm×30 mm,the inner wall diameter×length of the glass tube is φ56 mm×850 mm,the baseline travel speed is less than or equal to 20 m/min,the bottom diameter of the spiral blade is 5 mm,the blade thickness is 2 mm,and the concentration of diamond abrasive is 1.55 g/L.The optimal process parameters for electroplating diamond wire saws in the combina-tion device,determined by single-factor experiment are:the spiral blade number is 5,the spiral angle is 60°,the mixed liquid flow rate is 4.80 L/min,the fixed holder number is 12,the staggered arrangement angle of the permanent magnets is 60°,the magnetic field rotation speed is 60 r/min,and the magnetic field strength of the N38M permanent magnet is 0.549 T.The electroplating line produced under the optimal process parameters shows that the diamond particles are evenly distributed on the baseline surface without any stacking or agglomeration phenomenon,and the particle distribu-tion density is basically uniform.The number of diamond particles is 15 to 25 particles/mm,and the fluctuation range of diamond particle numbers is controlled within 11 particles/mm.Using this wire saw to slice a single crystal silicon rod with φ50.6 mm,the surface roughness Ra value of the silicon wafer in the feed direction is 0.583 μm,which is 35.9%and 28.2%lower than the literature values,respectively.Conclusions:The combined device of spiral bath flow and ro-tating magnetic field is designed to make the diamond abrasive particles in the mixed liquid evenly distributed in the bath flow mode,and orderly arranged according to the magnetic field line and rotated around the baseline.This can ba-sically eliminate the diamond agglomeration defect on the surface of the wire saw and improve the uniformity of the dis-tribution density of diamond particles.The average surface roughness of the silicon wafer in the feed direction is lower,so the workload of the subsequent grinding process can be reduced.关键词
电镀金刚石线锯/磨粒团聚/磨粒分布密度/螺旋镀液流/旋转磁场Key words
electroplated diamond wire saw/abrasive aggregation/particle distribution density/spiral plating solution flow/rotating magnetic field分类
化学化工引用本文复制引用
黄炜,贺艳明,徐金宝,宋振亚,黄翔,孙昱蒙,余锡孟..电镀金刚石线锯用螺旋镀液流和旋转磁场装置的设计与分析[J].金刚石与磨料磨具工程,2025,45(2):224-235,12.基金项目
浙江省市场监督管理局雏鹰计划培育项目(CY2023321) （CY2023321）
浙江省市场监督管理局科技计划(全额自筹)项目(ZC2023083). （全额自筹）
