金属加工（热加工）Issue(5)：49-58,10.
微量Al元素添加对Sn-9Zn无铅钎料润湿性及焊点可靠性的影响
Effect of minor addition of Al on the wettability and joint reliability of Sn-9Zn lead-free solder
摘要
Abstract
In the field of electronic packaging,the wettability of lead-free solder and the reliability of solder joints play crucial roles in the quality of electronic devices.The effect of minor Al addition on the wettability of Sn-9Zn lead-free solder and solder joint reliability was investigated.The results indicate that 0.01wt.％and 0.02wt.％ Al additions decrease the wetting angle of Sn-9Zn solder from 37.26° to 31.57° and 27.22°,respectively.However,0.05wt.％Al addition increases the wetting angle to 42.52°.This is attributed to the fact that the Al is enriched on the surface of liquid solder,preferentially forming an Al-containing oxide film with higher density and fewer defects compared to Zn.This film hinders the reaction between O and the liquid solder,thereby enhancing the oxidation resistance of the solder.The thickness of the Al-containing oxide film is thin,facilitating the spreading of the liquid solder.However,excessive addition of Al leads to rapid oxide film formation,which deteriorates the solder's wettability.0.01wt.％ and 0.02wt.％ Al additions improve the reliability of Sn-9Zn/Cu solder joint,but the reliability of the joint is deteriorated by the addition of 0.05wt.％Al.The optimum addition of Al to Sn-9Zn solder is 0.02wt.％.关键词
Sn-Zn无铅钎料/润湿性/抗氧化性/氧化膜/剪切强度Key words
Sn-Zn lead-free solder/wettability/oxidation resistance/oxide film/shear strength引用本文复制引用
张晓敏,张知航,杨健,肖皓月..微量Al元素添加对Sn-9Zn无铅钎料润湿性及焊点可靠性的影响[J].金属加工（热加工）,2025,(5):49-58,10.基金项目
国家自然科学基金面上项目(52075035). （52075035）
