塑料科技2025，Vol.53Issue(4)：39-45,7.DOI:10.15925/j.cnki.issn1005-3360.2025.04.007
环氧树脂/锡铋合金异质结构复合材料的制备及性能研究
Preparation and Properties Study of Epoxy Resin/Tin Bismuth Alloy Heterostructured Composite Materials
摘要
Abstract
With the arrival of the 5G era,the thermal management problem of electronic products urgently needs to be solved.Polymer based thermal conductive materials have advantages such as good flexibility,low density,good insulation,low cost,corrosion resistance,and easy processing,but their poor thermal conductivity limits their application in this field.The article combined tin bismuth alloy and epoxy resin to prepare heterogeneous composites,fully leveraging the characteristics of tin bismuth alloy such as low melting point,low density,good conductivity,and low cost,as well as the excellent physical properties,chemical stability,electrical insulation performance,and processing performance of epoxy resin.The effects of the amount of curing agent 593(15%,25%),the particle size of Sn42Bi58(35,44 μm),and the mass fraction of Sn42Bi58 particles(5%,10%)on the structure and properties of the composite materials were investigated.The results show that the epoxy resin/Sn42Bi58 composites exhibits a three-layer composite structure.The composites with a 25%addition of 593 curing agent has higher thermal stability,elastic modulus,and fracture strength compared to the 15%sample.The interface between 35 μm Sn42Bi58 particles and epoxy resin has better fusion,higher glass transition temperature,better thermal stability,and larger thermal conductivity of the composites.The more 35 μm Sn42Bi58 particles added,the higher the thermal conductivity,and as the temperature increases,the thermal conductivity also increases.The E51/C.A.593-25/Sn42Bi58-35 composites has the best comprehensive performance and has the potential to be used as a polymer based thermal conductive material in electronic products.关键词
环氧树脂/锡铋合金/异质结构/力学性能/导热性能Key words
Epoxy resin/Tin bismuth alloy/Heterostructure/Mechanical properties/Thermal conductivity分类
通用工业技术引用本文复制引用
李保君,孔丁峰,刘永佳..环氧树脂/锡铋合金异质结构复合材料的制备及性能研究[J].塑料科技,2025,53(4):39-45,7.基金项目
上海市优秀学术/技术带头人计划项目(23XD1431800) （23XD1431800）
福建省STS计划配套院省合作项目(2023T3053) （2023T3053）
