红外技术2025，Vol.47Issue(5)：571-577,7.
EBAPS器件中陶瓷基座与CMOS硅基芯片的粘接
Bonding of Ceramic Substrate and CMOS Chip of EBAPS Devices
谭何盛 1张昆林 1陈明欣 1赵恒 2王玲燕 1杨文波 1邓华兵 1靳英坤 1冯云祥 1刀丽纯1
作者信息
- 1. 北方夜视技术股份有限公司,云南 昆明 650214
- 2. 北方夜视技术股份有限公司,云南 昆明 650214||红外探测全国重点实验室,云南 昆明 650223
- 折叠
摘要
Abstract
An electron bombardment active pixel sensor(EBAPS)is a hybrid optoelectronic imaging device that combines vacuum and solid-state devices.Its vacuum sealing requires high-temperature baking and degassing processes.During development,a key challenge is addressing the issue of the epoxy adhesive used to bond the silicon-based chip in the complementary metal oxide semiconductor(CMOS)image sensor to the ceramic base,which may decompose at high temperatures,causing the CMOS chip to detach and fail to capture images.To address this,the project team used three types of solder alloys with similar melting points:Au88Ge12,Pb92.5In5Ag2.5,and Zn-Al-Ag-Cu to bond the metallized CMOS silicon-based chip to the ceramic base.The cross-sections of the CMOS image sensors soldered with these three types of solders were tested and characterized using scanning electron microscopy(SEM)and energy dispersive spectrometry(EDS)to analyze the performance of the solder joints.The results indicated that the CMOS image sensor soldered with Au88Ge12 achieved stable and reliable connection performance.关键词
AuGe合金/EBAPS/真空焊接/元素扩散Key words
AuGe alloy/EBAPS/vacuum welding/element diffusion分类
金属材料引用本文复制引用
谭何盛,张昆林,陈明欣,赵恒,王玲燕,杨文波,邓华兵,靳英坤,冯云祥,刀丽纯..EBAPS器件中陶瓷基座与CMOS硅基芯片的粘接[J].红外技术,2025,47(5):571-577,7.
