首页|期刊导航|实验与计算多相流（英文）|A new flat electronics cooling device composed of internal parallel loop heat pipes
实验与计算多相流（英文）2024，Vol.6Issue(3)：277-286,10.DOI:10.1007/s42757-024-0187-0
A new flat electronics cooling device composed of internal parallel loop heat pipes
A new flat electronics cooling device composed of internal parallel loop heat pipes
摘要
关键词
two-phase device/loop heat pipe(LHP)/parallel arrangement/pulsating heat pipe(PHP)/diffusion bonding/electronics coolingKey words
two-phase device/loop heat pipe(LHP)/parallel arrangement/pulsating heat pipe(PHP)/diffusion bonding/electronics cooling引用本文复制引用
Larissa Krambeck,Kelvin Guessi Domiciano,Marcia B.H.Mantelli..A new flat electronics cooling device composed of internal parallel loop heat pipes[J].实验与计算多相流（英文）,2024,6(3):277-286,10.基金项目
The authors acknowledge the National Council for Scientific and Technological Development(CNPq),National Fund for Scientific and Technological Development(FNDCT),and Ministry of Science,Technology,and Innovations(MCTI)for project fundings 405784/2022-8 and 406451/2021-4 and a scholarship under grant number 381267/2023-7.The authors also acknowledge the Foundation for Research Support of Santa Catarina(FAPESC)for providing a scholarship under grant number 3003/2021. （CNPq）
