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Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

Shang Gao Haoxiang Wang Han Huang Zhigang Dong Renke Kang

International Journal of Extreme Manufacturing2025，Vol.7Issue(3)：P.423-449,27.

International Journal of Extreme Manufacturing2025，Vol.7Issue(3)：P.423-449,27.DOI:10.1088/2631-7990/adae67

Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

Shang Gao ¹Haoxiang Wang ¹Han Huang ²Zhigang Dong ¹Renke Kang¹

作者信息

1. State Key Laboratory of High-performance Precision Manufacturing,Dalian University of Technology,Dalian 116024,People’s Republic of China
2. School of Advanced Manufacturing,Sun Yat-sen University,Shenzhen,People’s Republic of China
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摘要

关键词

surface quality/grinding/predictive models/semiconductor materials/surface roughness/subsurface damage depth

分类

矿业与冶金

引用本文复制引用

Shang Gao,Haoxiang Wang,Han Huang,Zhigang Dong,Renke Kang..Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding[J].International Journal of Extreme Manufacturing,2025,7(3):P.423-449,27.

基金项目

supported by the National Key Research and Development Program of China(2022YFB3605902) （2022YFB3605902）

the National Natural Science Foundation of China(52375411,52293402)。（52375411,52293402）

International Journal of Extreme Manufacturing

ISSN：2631-8644

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