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Thermoelectric cooling goes cooler

Sheng Qian Chenguang Fu Tiejun Zhu

National Science Open2025，Vol.4Issue(3)：P.11-14,4.

National Science Open2025，Vol.4Issue(3)：P.11-14,4.DOI:10.1360/nso/20250009

Thermoelectric cooling goes cooler

Sheng Qian ¹Chenguang Fu ¹Tiejun Zhu²

作者信息

1. State Key Laboratory of Silicon and Advanced Semiconductor Materials,School of Materials Science and Engineering,Zhejiang University,Hangzhou 310058,China
2. State Key Laboratory of Silicon and Advanced Semiconductor Materials,School of Materials Science and Engineering,Zhejiang University,Hangzhou 310058,China Institute of Wenzhou,Zhejiang University,Wenzhou 325006,China
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摘要

关键词

heat redistribution/charge carrierswhich/thermoelectric cooling tec/long term reliability/solid state technology/vibration free performance/miniaturization/thermoelectric cooling

分类

通用工业技术

引用本文复制引用

Sheng Qian,Chenguang Fu,Tiejun Zhu..Thermoelectric cooling goes cooler[J].National Science Open,2025,4(3):P.11-14,4.

基金项目

supported by the National Key Research and Development Program of China(2024YFA1409200) （2024YFA1409200）

the National Natural Science Foundation of China(52471239) （52471239）

the Fundamental Research Funds for the Central Universities(226-2024-00075)。（226-2024-00075）

National Science Open

ISSN：2097-1168

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