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断路器自力型触指通流能力提升研究与分析

范艳艳 苗晓军 张彦敏 国秀花 李闪光 许东杰 李凯 郝留成 钟建英

高压电器2025,Vol.61Issue(6):68-76,91,10.
高压电器2025,Vol.61Issue(6):68-76,91,10.DOI:10.13296/j.1001-1609.hva.2025.06.008

断路器自力型触指通流能力提升研究与分析

Study and Analysis on Current-flow Capacity Improvement of Self-propelled Contact Finger of Circuit Breaker

范艳艳 1苗晓军 1张彦敏 2国秀花 2李闪光 2许东杰 1李凯 1郝留成 1钟建英1

作者信息

  • 1. 平高集团有限公司,河南 平顶山 467001
  • 2. 河南科技大学材料科学与工程学院,河南 洛阳 471023
  • 折叠

摘要

Abstract

In view of such phenomenon as serious heat and excessive temperature rise of T2Y self-propelled contact finger for a circuit breaker during the temperature-raise test,the performance of raw materials for the contact finger is tested and studied.At the same time,the structure of the T2Y self-propelled contact finger is simulated and opti-mized in combination with the actual service condition of the contact finer.The simulation results show that under the same service condition the maximum elastic deformation of the contact finger after structure optimization is de-creased from 0.126 mm before optimization to 0.045 mm,and the maximum equivalent stress is decreased from 175.56 MPa to 72.74 MPa,which is reduced by 64.7%and 58.6%respectively than that before optimization.The ex-perimental verification results show that the gripping force of CuCr1Zr contact after 10 000 mechanical endurance tests is approximately 16.35 N,which is about 34.46%higher than 12.16 N of T2Y.This effectively avoids the distor-tion of electric field across open contacts and decrease of breaking performance due to insufficient gripping force dur-ing the service of the contact.At the same time,it together with the circuit breaker successfully passed the 6 300 A×1.1 times temperature rise test.

关键词

自力型触指/结构优化/应力松弛/抱紧力/温升试验

Key words

self-propelled contact finger/structure optimization/stress relaxation/gripping force/temperature rise test

引用本文复制引用

范艳艳,苗晓军,张彦敏,国秀花,李闪光,许东杰,李凯,郝留成,钟建英..断路器自力型触指通流能力提升研究与分析[J].高压电器,2025,61(6):68-76,91,10.

基金项目

河南省科技研发计划联合基金(225200810052).Project Supported by Henan Science and Technology R&D Plan Joint Fund(225200810052). (225200810052)

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1001-1609

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