现代雷达2025，Vol.47Issue(5)：59-62,4.DOI:10.16592/j.cnki.1004-7859.20230104002
基于CCGA的射频传输特性分析
Analysis of RF Transmission on CCGA
谢书珊 1谭良辰 1阮文州 1蔡晓波 1李福勇1
作者信息
- 1. 南京电子技术研究所,江苏 南京 210039
- 折叠
摘要
Abstract
Ceramic-based packaging substrates for system-in-package(SiP)have the characteristics of a large number of ball grid array(BGA)pins and good application compatibility,and are widely used in digital circuits,analog circuits,and RF circuit SiP.With the increase in system functionality,ceramic-based packaging substrates for SiP require larger dimensions and a grea-ter number of BGA pins,which leads to an increase in thermal mismatch due to the mismatch in thermal expansion coefficients of different materials between the ceramic-based packaging substrates and the printed circuit board(PCB),thereby significantly af-fecting the reliability of BGA interconnections.Replacing the PCB with copper column grid array(CCGA)pins increases the distance between the ceramic substrate and the PCB,effectively reducing the impact of thermal mismatch on connection reliabili-ty.In this paper,structural and RF performance simulations,and experimental verification were carried out for studying the con-nection between RF SiP using CCGA and the PCB under thermal load conditions.Simulation and experimental results show that thermal stress is concentrated at the root of the corner positions of the SiP geometric structure.The CCGA-based RF SiP designed in this study demonstrates effective capability of withstanding thermal mismatch-induced structural stress and excellent RF trans-mission performance.关键词
铜柱栅格阵列/陶瓷基封装基板/系统级封装/热失配Key words
copper column grid array(CCGA)/ceramic-based packaging substrate/system-in-package(SiP)/thermal mismatch分类
电子信息工程引用本文复制引用
谢书珊,谭良辰,阮文州,蔡晓波,李福勇..基于CCGA的射频传输特性分析[J].现代雷达,2025,47(5):59-62,4.
