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器官芯片在太空应用的工程难点和解决方案分析

尉雅明 邹建锋 黄小桃

中国空间科学技术(中英文)2025,Vol.45Issue(3):67-76,10.
中国空间科学技术(中英文)2025,Vol.45Issue(3):67-76,10.DOI:10.16708/j.cnki.1000-758X.2025.0039

器官芯片在太空应用的工程难点和解决方案分析

Analysis of engineering challenges and solutions for organ-on-a-chip applications in space

尉雅明 1邹建锋 1黄小桃2

作者信息

  • 1. 浙江大学 航空航天学院,杭州 310027
  • 2. 广东顺德工业设计研究院(广东顺德创新研究院),佛山 528000
  • 折叠

摘要

Abstract

This study systematically analyzes the engineering challenges associated with the application of organ chips in space and proposes corresponding solutions.It begins by reviewing the development of organ chip technology and its potential applications in space.The paper then examines the effects of the space environment,such as microgravity,radiation,and temperature fluctuations,on organ chips.The difficulties related to functional complexity,power consumption,size limitations,long-term stability,the need for standardization and validation are analyzed.Concluding the analysis,the study offers solutions that encompass surface coating and functional modifications,microenvironment control,automated monitoring and control systems,thereby providing an engineering framework for the deployment of organ chips in space.

关键词

器官芯片/太空应用/航天医学/航天器

Key words

organ-on-a-chip/space application/aerospace medicine/spacecraft

引用本文复制引用

尉雅明,邹建锋,黄小桃..器官芯片在太空应用的工程难点和解决方案分析[J].中国空间科学技术(中英文),2025,45(3):67-76,10.

基金项目

国家自然科学基金(12172329) (12172329)

国家科技重大专项(J2019-Ⅲ-0004-0047) (J2019-Ⅲ-0004-0047)

中国空间科学技术(中英文)

OA北大核心

1000-758X

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