电讯技术2025，Vol.65Issue(6)：980-985,6.DOI:10.20079/j.issn.1001-893x.240528001
一种K波段晶圆级封装器件化R组件设计
Design of a K-band Wafer-level Package Rx Module
朱贵德 1罗鑫 1王军会 1罗里 1何小峰1
作者信息
摘要
Abstract
A K-band device Rx(Recieve)module based on resin-based fan-out wafer-level package is presented.A compact 8-channel numerical control delay low noise amplification front end is realized by using a chip architecture combining complementary metal oxide semiconductor(CMOS)process and GaAs process.By using the plastic-sealed fan-out wafer-level packaging technology,the ground pad position is set reasonably on two kinds of chips,and then with the help of the rewiring design of wafer-level packaging and the planting ball technology,the electromagnetic shielding between multiple channels and multiple packages is realized in a single package.A wafer-level fan-out package device Rx module is developed by using a multi-physical field co-simulation method,which combines the field-level full-wave simulation results of passive interconnection with the circuit-level simulation results of active circuits.The measured results show that the noise coefficient is less than 2.1 dB in K-band,the small signal gain is more than 22 dB,the delay error root mean square is less than 1.8 ps,the size of the Rx module is 11 mm×8 mm×0.7 mm,and the weight is only 0.2 g.This design scheme gives full play to the digital-analog hybrid integration capability of the CMOS process and the excellent RF performance of the GaAs process,realizes the higher functional density,channel density,and low-cost requirements of R components,and has certain engineering application value.关键词
相控阵天线/K波段R组件/晶圆级扇出封装/场路协同仿真Key words
phased array antenna/K-band Rx module/wafer-level fan-out package/field-circuit co-simulation分类
信息技术与安全科学引用本文复制引用
朱贵德,罗鑫,王军会,罗里,何小峰..一种K波段晶圆级封装器件化R组件设计[J].电讯技术,2025,65(6):980-985,6.
