机电工程技术2025，Vol.54Issue(10)：140-144,5.DOI:10.3969/j.issn.1009-9492.2025.10.029
提升功率印制电路板导热灌胶的整体性能研究
Research on Improving the Overall Performance of Pouring Sealant of Thermal Conductivity in Power PCBA
吴继平 1刘春桂 1闫继豪 1唐晓明 1洪伟 1沈晗1
作者信息
- 1. 常州博瑞电力自动化设备有限公司,江苏 常州 213025
- 折叠
摘要
Abstract
To improve the thermal performance of PCBA potting,the reliability under complex operating conditions such as high temperature,high humidity,sulfur environment and high frequency vibration is improved,and the service life of power PCBA products is extended.The material selection,structure design and size setting of the PCBA pouring glue shell are analyzed,the heat conduction distance of the pouring glue was optimized,and the heat dissipation performance of the shell was improved,combined with the fluidity of the heat-conducting sealant,the location,size and quantity of the filling orifice and the vent hole on the shell were optimized,the thermal conductivity of the sealant can be improved by reducing the bubble rate of the sealant,and the heat dissipation performance of PCBA can be improved.After analyzing the structure and shape of PCBA plug-in,the plug-in selection and connection mode were optimized,and the PCBA conductor connection scheme was formed.Further tests on the potting and curing of power PCBA coated with three-proof paint were carried out,and two protection schemes,with and without three-proof protection,were developed to enhance reliability.Improving the overall performance of power PCBA not only makes the product have better performance,but also helps to enhance the reputation of the industry and enhance the impact of the brand.关键词
灌胶/PCBA/导热/外壳/性能Key words
pouring sealant/PCBA/heat conduction/shell/performance分类
信息技术与安全科学引用本文复制引用
吴继平,刘春桂,闫继豪,唐晓明,洪伟,沈晗..提升功率印制电路板导热灌胶的整体性能研究[J].机电工程技术,2025,54(10):140-144,5.
