机电工程技术2025，Vol.54Issue(9)：41-45,5.DOI:10.3969/j.issn.1009-9492.2025.09.009
BGA塑封器件热可靠性研究
Study on Thermal Reliability of BGA Plastic Packaging Devices
李登科 1王高凯1
作者信息
- 1. 中国空空导弹研究院,河南 洛阳 471009
- 折叠
摘要
Abstract
In the context of the prevalent trend of miniaturization and weight reduction in electronic devices,the ball grid array(BGA)packaging format has become the mainstream packaging format for electronic components due to its high density and high performance advantages,and is widely used in various electronic products.Therefore,investigating the reliability of BGA packaging is of paramount importance.ANSYS Workbench is employed to conduct temperature cycling simulations on a specific model of BGA plastic-encapsulated device,the thermal stress changes are simulated in different parts of the device under conditions from 25℃to 150℃and then to 50℃,and the stress distribution in various parts of the BGA device during the temperature cycle is studied.The results indicate that due to the differences in thermal expansion coefficients,significant stresses are concentrated at the interfaces where distinct structures of the BGA device interface,rendering these regions prone to failure.Furthermore,it is observed that the stresses on the bumps and solder balls are markedly elevated at low temperatures,with the cooling phase exerting a more pronounced influence on the solder material.This research elucidates the impact of thermal stresses on the various components of the BGA device,thereby providing valuable data to underpin thermal reliability studies of BGA devices.关键词
塑封器件/球栅阵列(BGA)/温度循环/有限元仿真/可靠性Key words
plastic packaging device/ball grid array(BGA)/temperature cycling/finite element simulation/reliability分类
信息技术与安全科学引用本文复制引用
李登科,王高凯..BGA塑封器件热可靠性研究[J].机电工程技术,2025,54(9):41-45,5.
