铜业工程Issue(3)：1-8,8.DOI:10.3969/j.issn.1009-3842.2025.03.001
高强电解铜箔微观组织结构与性能调控机制研究
Optimization of Process Parameters on Microstructural and Mechanical Prop-erties of High-Strength Electrolytic Copper Foil
摘要
Abstract
Due to unique process design flexibility,pulse electrodeposition technology has been widely applied to fabricate copper foils for high-performance electronic devices.Based on the pulse electrodeposition principle,Cu2+adjacent to the cathode experience rapid depletion during the on-time phase.In contrast,during the off-time phase,Cu2+near the cathode can be replenished promptly.This mechanism enables pulse electrodeposition to effectively enhance the microstructural uniformity and comprehensive mechanical proper-ties of copper foils.This paper investigated the microstructural evolution and structure-property relationships of pulse-electrodeposited copper foils in additive-free systems.Using optimized pulse parameters,controllable preparation of copper foils were prepared with tai-lored mechanical properties.Under optimal conditions,the prepared copper foils exhibited tensile strength and elongation values of up to 467.5 MPa and 6.89%,respectively,while surface roughness remained as low as 1.587 µm.关键词
脉冲电沉积/组织结构/抗拉强度/延伸率/粗糙度Key words
pulse electrodeposition/microstructure/tensile strength/elongation/roughness分类
金属材料引用本文复制引用
徐鹏,乔灵慧,卢伟伟,朱倩倩,刘海涛,宋克兴..高强电解铜箔微观组织结构与性能调控机制研究[J].铜业工程,2025,(3):1-8,8.基金项目
河南省科技研发计划联合基金重点项目(225200810026) （225200810026）
国家重点研发计划项目(2021YFB3400800) （2021YFB3400800）
河南省中原学者工作站资助项目(244400510012) （244400510012）
河南省重点研发专项(231111241000)资助 （231111241000）
