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低成本无钯活化复合铜箔化学镀技术研究

杨恒亮 张菁丽 刘二勇 蔡辉 白忠波 李晓晗 马超

铜业工程Issue(3):17-24,8.
铜业工程Issue(3):17-24,8.DOI:10.3969/j.issn.1009-3842.2025.03.003

低成本无钯活化复合铜箔化学镀技术研究

Low-Cost and Palladium-Free Electroless Plating Technology of Composite Copper Foil

杨恒亮 1张菁丽 1刘二勇 1蔡辉 1白忠波 2李晓晗 3马超1

作者信息

  • 1. 西安科技大学材料科学与工程学院,陕西 西安 710054||电子铜箔及应用陕西省高校工程研究中心,陕西 西安 710054
  • 2. 灵宝华鑫铜箔有限责任公司,河南 灵宝 472500
  • 3. 陕西汉和新材料科技有限公司,陕西 宝鸡 721703
  • 折叠

摘要

Abstract

To address the high cost of traditional palladium activation processes in fabrication of lithium battery anode current collector,this study proposed a palladium-free electroless plating technology based on a copper activation layer,aiming to reduce the manufactur-ing cost of composite copper foils while maintaining coating performance.Using polyamide 6(PA6)film as the substrate,a sulfuric acid-formic acid-propionic acid system was employed for surface roughening treatment.Copper ions(Cu2+)were adsorbed and subsequently reduced by sodium borohydride(NaBH₄)to form a copper activation layer,followed by electroless copper plating.The surface wettabili-ty and microstructural evolution were analyzed through contact angle measurements and scanning electron microscopy(SEM),while the influence of roughening time and NaBH₄ concentration on coating performance was systematically investigated via particle size distribu-tion statistics of the electroless copper layer.The roughening process significantly enhanced the hydrophilicity and roughness of PA6,with the contact angle decreasing progressively as roughening time increased.Surface amino and carboxyl functional groups formed when roughening improved Cu2⁺ adsorption capacity.Prolonged roughening time reduced the particle size of the electroless copper lay-er and enhanced uniformity.Increasing NaBH₄ concentration to 50 g/L markedly improved the compactness of the copper activation lay-er,achieving complete coating coverage.Compared to traditional palladium activation,the copper activation layer drastically reduced costs while meeting basic conductivity and adhesion strength requirements.This study successfully developed a low-cost,palladium-free composite copper foil fabrication process,optimizing roughening and reduction parameters to achieve efficient substitution of palla-dium by copper activation layers.The proposed strategy offers significant industrial application potential for cost-effective manufactur-ing of lithium battery current collectors.

关键词

负极集流体/复合铜箔/无钯活化/铜活化层/化学镀

Key words

anode current collector/composite copper foil/palladium-free activation/copper activation layer/electroless plating

分类

通用工业技术

引用本文复制引用

杨恒亮,张菁丽,刘二勇,蔡辉,白忠波,李晓晗,马超..低成本无钯活化复合铜箔化学镀技术研究[J].铜业工程,2025,(3):17-24,8.

基金项目

陕西省教育厅科技服务地方专项(23JC051) (23JC051)

陕西省科技厅自然科学基础研究计划(2023-JC-QN-0507)资助 (2023-JC-QN-0507)

铜业工程

1009-3842

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