现代电子技术2025，Vol.48Issue(14)：98-102,5.DOI:10.16652/j.issn.1004-373x.2025.14.016
星载高性能信号处理平台热设计
Thermal design of high performance space-borne digital process platform
徐晓瑶 1魏来 1袁俊 1高林杰1
作者信息
- 1. 中国电子科技集团公司第三十六研究所,浙江 嘉兴 314033
- 折叠
摘要
Abstract
The requirements for high bandwidth,strong processing capability,and integration of space-borne signal processing equipment are increasing day by day,and the power consumption of signal processing platforms is also increasing.Thermal design has become a difficult point in the design of processing platforms.The FLOTHERM analysis software is used to establish a thermal analysis model for a high-performance space-borne signal processing platform,analyzing the effects of thermal pads,box materials and thickness,and printed circuit boards on heat dissipation.The research results indicate that when the power consumption of the digital processing board reaches 120 W,the combination of high-efficiency thermal conductive pads and new structural materials for temperature equalization plates can meet the requirements of level I derating for aerospace products in terms of the junction temperature of its core high-power devices.关键词
星载/高性能信号处理/热设计/数字处理板/导热衬垫/印制电路板/均温板/结温Key words
space-borne/high performance signal process/thermal design/digital processing board/thermal pad/printed circuit board/uniform temperature plate/junction temperature分类
信息技术与安全科学引用本文复制引用
徐晓瑶,魏来,袁俊,高林杰..星载高性能信号处理平台热设计[J].现代电子技术,2025,48(14):98-102,5.
