电子科技大学学报2025，Vol.54Issue(4)：494-500,7.DOI:10.12178/1001-0548.2024318
基于LTCC基板直线型微流道散热设计与仿真
Design and simulation of straight microchannel heat dissipation based on LTCC substrate
摘要
Abstract
Focusing on the issue of relatively low heat dissipation efficiency of complex structures in straight microchannels on LTCC substrates,a metal silver heat conduction column structure is set on the microchannel packaging layer to enhance the heat dissipation effect of straight microchannel heat sinks.Firstly,three different numbers of flow channels and ten metal column structures are added to the straight microchannel heat sink finite element model,which was constructed by using ANSYS finite element numerical simulation,and thermal-fluid coupling simulation analysis is carried out.Then,the impact of different flow channel numbers and different metal column structure arrangements as well as metal column diameters and lengths on the heat dissipation effect is studied.The simulation results show that the microchannel heat sink with 13 flow channels and a metal silver heat conduction column with a diameter of 0.25 mm and a length of 0.625 mm performs the best in heat dissipation performance.Compared with the straight microchannel structure before optimization,the heat dissipation effect is improved by 8.72%.关键词
散热/LTCC基板/微流道/金属柱热通孔/直线型Key words
heat dissipation/LTCC substrate/micro channel/metal column thermal via/straight type分类
信息技术与安全科学引用本文复制引用
于浩然,吉喆,严英占..基于LTCC基板直线型微流道散热设计与仿真[J].电子科技大学学报,2025,54(4):494-500,7.基金项目
河北省高等学校科学技术研究项目(ZD2022106) （ZD2022106）
