高电压技术2025，Vol.51Issue(6)：2641-2650,10.DOI:10.13336/j.1003-6520.hve.20241236
结构约束下环氧树脂固化残余应力的测试技术与工艺优化
Measurement Technology and Process Optimization of Curing Residual Stress of Epoxy Resin Under Structural Constraint
摘要
Abstract
Epoxy resin is widely used in insulation packaging of electrical equipment and electronic devices.Its curing residual stress may cause matrix defects or even cracks,which is an important hidden danger threatening the insulation re-liability of products.Based on the understanding of the packaging structural constraint on epoxy resin and its effect on stress,a thick-walled cylindrical structure for packaging stress testing was designed in this paper,which can freely control the restricted constraint degree of epoxy resin.Furthermore,a methodology for curing residual stress testing and curing process optimization was proposed by utilizing the thick-walled cylindrical structures with equivalent constraint charac-teristics to actual products.By using the equivalent thick-walled cylindrical structure of a high-frequency transformer product with strain gauge monitoring,the influences of various process parameters on curing residual stress and its mechanism were studied.By prolonging the gel temperature holding duration,reducing the heating rate,and increasing the curing temperature,the thermal expansion stress in heating stage is enhanced and the thermal contraction stress in cooling stage is weakened.As a result,the measured contraction strain induced by curing residual stress is significantly reduced from 1 610× 10-6 to 690× 10-6,effectively eliminating epoxy cracking and associated breakdown failure within the product.The proposed curing process design methodology and the elucidated curing residual stress evolution mechanisms facilitate the rapid and precise design of curing process for diverse epoxy packaging products.关键词
环氧树脂/绝缘封装/固化残余应力/结构约束/固化工艺参数Key words
epoxy resin/insulation packaging/curing residual stress/structural constraint/curing process parameters引用本文复制引用
茹佳胜,赵先航,李想,刘鑫,李悦芳,钟华,陈磊..结构约束下环氧树脂固化残余应力的测试技术与工艺优化[J].高电压技术,2025,51(6):2641-2650,10.基金项目
国家自然科学基金(12205263) （12205263）
国防科技基础加强计划技术领域基金(2023-JCJQ-JJ-0200).Project supported by National Natural Science Foundation of China(12205263),Technology Field Fund of National Defense Science and Tech-nology Foundation Strengthening Program(2023-JCJQ-JJ-0200). （2023-JCJQ-JJ-0200）
