华侨大学学报（自然科学版）2025，Vol.46Issue(4)：379-385,7.DOI:10.11830/ISSN.1000-5013.202504038
活性添加剂分散调控对镀铜线精细化的影响
Influence of Dispersion Control of Active Additives on Refinement of Copper Plated Wire
摘要
Abstract
To address the issue of edge refinement of copper plated wires in flexible cathode electrochemical machining,the influence of additive particle size and dispersion on copper plating quality was studied.The grinding time of additive particles and the slurry stirring method were adjusted,and laser activation was com-bined with electroless copper plating processes to prepare conductive wires and their morphology was analyzed.The results demonstrated that grinding time significantly influenced the particle size,which stabilized at 1.445μm after 48 hours of grinding,with improved dispersibility and reduced agglomeration.After stirring for 5 mi-nutes using a high-speed disperser,the particle area fraction in polyurethane decreased by 11.9％compared to traditional stirring.The refinement and uniformly dispersed additive particles improved the uniformity of laser activated catalytic centers.Under the optimal conditions(48 hours grinding and 5 minutes high-speed stir-ring),the copper plated wires exhibited sharp and well-defined edges,uniform distribution,and a consistent wire width of approximately 85.1 μm.关键词
电解加工/激光活化/化学镀铜/线条精细化/颗粒分散性Key words
electrochemical machining/laser activation/electroless plating copper/refinement/particle dis-persibility分类
化学化工引用本文复制引用
乐其河,江开勇..活性添加剂分散调控对镀铜线精细化的影响[J].华侨大学学报（自然科学版）,2025,46(4):379-385,7.基金项目
国家自然科学基金资助项目(51475174) （51475174）
