上海航天（中英文）2025，Vol.42Issue(4)：66-74,9.DOI:10.19328/j.cnki.2096-8655.2025.04.007
微系统先进封装3D CT无损检测方法研究
Research on 3D CT Non-destructive Testing Methods for Advanced Packaging of Microsystems
杜林 1蒋珚 2孔泽斌 1汪波 1朱敏蔚 1王兰来 1王昆黍1
作者信息
- 1. 上海航天技术基础研究所,上海 201109
- 2. 上海航天控制技术研究所,上海 201109
- 折叠
摘要
Abstract
The evolution trend of advanced packaging architectures for microsystem devices is analyzed,and the reliability issues and risks of the most widely used 2.5D advanced packaging structure for microsystems are summarized.In view of the difficulties in detecting typical risks of high-value microsystem devices,the non-destructive testing methods are studied.The experiment adopts a 3D micro computed tomography(CT)method,and the characteristics of 2.5D advanced microsystem packaging are analyzed based on a nano-microfocus X-ray tube.For the first time,a contour analysis method based on 2D solder ball virtual slice data is proposed,and the analysis accuracy of the micro-warpage of the interposer reaches 1 μm.The 3D non-destructive testing accuracy of the fine size of the internal through silicon via(TSV)is verified by comparing the TSV 2D slice data with the scanning electron micro-scope sample data.The copper convex morphology in the interposer is confirmed by the analysis on the experimental data of the interposer.The measured data are displayed,which characterize the quality of the micro-solder joints of the resistor welding on the interposer.This paper provides a new evaluation method for the reliability evaluation of advanced microsystem packaging.The experimental data confirm the effectiveness of the method,and provide a reference for the defect identification.关键词
2.5D先进封装/3D CT/无损/微系统/微翘曲Key words
2.5D advanced packaging/3D CT/non-destructive/microsystem/micro-warpage分类
信息技术与安全科学引用本文复制引用
杜林,蒋珚,孔泽斌,汪波,朱敏蔚,王兰来,王昆黍..微系统先进封装3D CT无损检测方法研究[J].上海航天（中英文）,2025,42(4):66-74,9.
