电瓷避雷器Issue(4)：59-64,6.DOI:10.16188/j.isa.1003-8337.2025.04.008
氧化锌压敏电阻铜浆用无铅电子玻璃粉的制备与性能
Preparation and Properties of Lead-Free Electronic Glass Powder for Copper Paste of ZnO Varistor
摘要
Abstract
Low adhesion is the main problem of copper paste used in varistor.The effects of chemical composition of glass,milling time,ratio of stone to glass powder and particle size of glass powder on cop-per paste were studied.The results show that suitable glass chemical composition and particle size are the key factors for preparing qualified copper paste.Select the appropriate formula of glass powder,glass powder particle size is controlled at d50=1.5 μm±0.1 μm,vitrified temperature is controlled at 520 ℃±5 ℃,softening temperature is controlled at 440 ℃±10℃,the prepared copper paste indicators meet requirements,which can be used in production.关键词
铜浆/无铅电子玻璃粉/附着力/粒度/玻化温度Key words
copper paste/lead-free electronic glass powder/adhesion force/granularity/vitrified tem-perature引用本文复制引用
李东明,杨佩嘉,李宏杰,杨清帅,孙锐娟..氧化锌压敏电阻铜浆用无铅电子玻璃粉的制备与性能[J].电瓷避雷器,2025,(4):59-64,6.基金项目
陕西省重点研发计划项目(编号:2018GY-062).Project supported by the Key R & D Planned Industrial Project of Shaanxi Province(No.2018GY-062). （编号:2018GY-062）
