基于半刚性气囊的反应烧结碳化硅精密抛光特性OA
Precision Polishing Characteristics of Reaction-bonded Silicon Carbide Based on Semi-rigid Bonnet
围绕半刚性气囊在反应烧结碳化硅精密抛光中的性能展开实验分析,探讨其对材料去除特性及表面质量改善效果,通过白光干涉仪获取抛光表面三维形貌,并结合二维截面图验证球面特性,评估高精度抛光效果.实验结果表明,随着驻留时间和主轴转速的增加,材料去除量逐步提升,半刚性气囊抛光后,工件表面粗糙度由251.69 nm降低至8.72 nm,降幅达96.54%,表面均匀性显著提高,微观缺陷少.
The experiment was conducted to analysis the performance of a semi-rigid bonnet in the precision polishing of reaction-bonded silicon carbide,aiming to investigate its material removal characteristics and surface quality improvement effects.The 3D mor-phology of the polished surface was obtained using a white light interferometer,and the spherical characteristics were verified through 2D cross-sectional profiles to evaluate the high-precision polishing outcome.The results show that the amount of material removed increases progressively with longer dwell time and higher spindle speed.After polishing with the semi-rigid bonnet,the surface roughness of the workpiece decreased from 251.69 nm to 8.72 nm,with a reduction of 96.54%,which significantly improved surface uni-formity and reduced microscopic defects.
崔青青;傅建记;吴威;柯晓龙
厦门理工学院机械与汽车工程学院,厦门 361024厦门大学萨本栋微米纳米科学技术研究院,厦门 361102香港理工大学超精密加工技术国家重点实验室,香港 999077厦门理工学院机械与汽车工程学院,厦门 361024
矿业与冶金
材料去除气囊抛光精密抛光半刚性气囊
material removalbonnet polishingprecision polishingsemi-rigid bonnet
《青岛大学学报（自然科学版）》 2025 (3)
62-67,6
福建省自然科学基金(批准号:2022J011245)资助.
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