表面技术2025，Vol.54Issue(17)：80-90,182,12.DOI:10.16490/j.cnki.issn.1001-3660.2025.17.007
切削GH4169陶瓷刀具的黏结与扩散磨损研究
Research on Bonding and Diffusion Wear of Ceramic Tool during Cutting GH4169
摘要
Abstract
In order to study the bond diffusion wear mechanism of ceramic tools(silicon nitride tools)when cutting nickel-based superalloys GH4169 and the effects of wear on the friction coefficient,hardness and impact toughness of the tools,LAMMPS software is used to establish a cutting model of silicon nitride tools and nickel-based superalloys based on molecular dynamics(MD)methods to analyze the adhesion diffusion phenomenon of the tools by simulating cutting.By calculating the vacancy formation energy and vacancy migration energy of the atoms of the workpiece,the diffusion activation energies of Ni,Fe and Cr atoms are obtained.On this basis,the growth factors are fitted to determine the factors that control the growth rate of the adhesive.It aims to determine whether the tool has produced new compounds due to adhesive wear based on the radial distribution function of the tool,and then study its impact on tool performance.The diffusion activation energies at the grain boundaries of Ni,Fe,and Cr atoms are 5.29 eV,2.15 eV,and 0.7 eV,respectively.The diffusion activation energies at the lattice are 5.58 eV,3.42 eV,and 1.14 eV,respectively.The three atoms of Ni,Fe and Cr are more likely to diffuse at the grain boundary than at the crystal lattice,and the ranking of diffusion difficulty is:Ni＞Fe＞Cr,and the ranking of diffusion coefficient sizes is:Cr＞Fe＞Ni.The adhesion diffusion between the tool and the workpiece can be regarded as an interface reaction connection.The interface reaction growth kinetics is used to study the diffusion depth of the tool and the workpiece atoms is obtained.The simulating temperature is set at 1 200 K for 30 min,and the growth factors of Ni,Fe and Cr atoms are obtained by fitting and they are CCr=0.3,CNi=0.2,CFe=0.28.Through the analysis of growth factors and diffusion depth,three controlling factors of atomic growth rate are determined.The growth rate of Ni and Fe is controlled by the reaction rate,while the growth rate of Cr is mainly controlled by the diffusion rate.According to the simulated cutting process,the change of the coefficient of friction of the tool is obtained.The results show that when the binder is bonded to the surface of the tool,the friction coefficient increases and the coefficient of friction is drastically decreased when the binder falls off.Through the change of the radial distribution function of the tool,it is proved that during the cutting process,the workpiece combines with the tool atoms under the action of high temperature and produces new compounds.By comparing the hardness of the new compound with the original tool material,it can be seen that the formation of the new compound leads to a decrease in the hardness of the tool.The impact model of the rigid block and silicon nitride is established based on LAMMPS,and it is found that the impact toughness of the silicon nitride is increased by about 11.6％compared with that before the bond diffusion.关键词
镍基高温合金/氮化硅刀具/分子动力学/黏结磨损/扩散磨损Key words
nickel-based superalloy/silicon nitride tool/molecular dynamics/bonding wear/diffusion wear分类
机械制造引用本文复制引用
范依航,贾晓羽,郝兆朋..切削GH4169陶瓷刀具的黏结与扩散磨损研究[J].表面技术,2025,54(17):80-90,182,12.基金项目
国家自然科学基金(52375404)National Natural Science Foundation of China(52375404) （52375404）
