宇航材料工艺2025，Vol.55Issue(4)：81-86,6.DOI:10.12044/j.issn.1007-2330.2025.04.012
航天电子产品CQFP封装器件加固工艺可靠性研究
Reliability Study on Reinforcement Process of CQFP Packaged Devices for Aerospace Electronic Products
王海超 1文奕格 1费义鹍 1赵富贵 1丁颖洁1
作者信息
- 1. 上海航天控制技术研究所,上海 201100
- 折叠
摘要
Abstract
CQFP packaged devices were extensively applied in various aerospace electronic units,and their soldering quality directly impacted the reliability of the entire electronic system.This paper experimentally investigated the influence of different reinforcement methods for CQFP packaged devices on solder joint reliability.The results indicate that reinforcing the four corners of CQFP devices with EC-2216 epoxy adhesive satisfies the high-reliability soldering requirements of aerospace electronic products,making this the optimal adhesive method.Reinforcement of CQFP devices solely with GD414 silicone adhesive at the four corners exhibits inferior vibration resistance;therefore,silicone adhesive must be used to fill the gap between the printed circuit board and the ceramic body bottom or edges to enhance vibration resistance.However,when silicone rubber D04 completely encapsulates and fills the gull-wing leads of CQFP devices,lead stress cannot be relieved during temperature cycling tests,resulting in solder joint micro-void aggregation and cracking,thus significantly degrading thermal fatigue resistance.Therefore,when silicone reinforcement is applied to such devices,stress-relief regions must be provided around the leads.This study offers a valuable reference for the reinforcement techniques used in aerospace electronic products utilizing CQFP packaged devices.关键词
CQFP加固工艺/机械应力/热疲劳/焊点可靠性Key words
CQFP reinforcement process/Mechanical stress/Thermal fatigue/Solder joint reliability分类
矿业与冶金引用本文复制引用
王海超,文奕格,费义鹍,赵富贵,丁颖洁..航天电子产品CQFP封装器件加固工艺可靠性研究[J].宇航材料工艺,2025,55(4):81-86,6.
