集成电路与嵌入式系统2025，Vol.25Issue(9)：1-13,13.DOI:10.20193/j.ices2097-4191.2025.0025
面向芯粒集成的玻璃芯基板应用与关键挑战
Applications and major challenges of glass core substrate for chiplet integration
摘要
Abstract
The growing demand for massive data processing such as artificial intelligence has greatly promoted the development of chiplet integration technology,which further imposes technical requirements on FC-BGA substrates,including large size,low warpage,electri-cal performance and high reliability.The late-model glass core substrate has attracted extensive attention owing to its intrinsic low die-lectric coefficient,high thermal stability and chemical inertness.However,current glass core substrate technology remains in the initial stage of mass production,lacking comprehensive,reliable and standardized methods of producation,application and testing.This article overviews the history,characteristics,and present challenges of glass core substrate.It also provides a summary and prospect on the fu-ture applications of glass core substrate in chiplet integration.关键词
芯粒集成/玻璃芯基板/玻璃通孔Key words
chiplet integration/glass core substrate/through glass vias分类
信息技术与安全科学引用本文复制引用
陈昶昊,徐士猛,林鹏荣..面向芯粒集成的玻璃芯基板应用与关键挑战[J].集成电路与嵌入式系统,2025,25(9):1-13,13.基金项目
北京市科技计划项目(Z231100005923008) （Z231100005923008）
