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Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers

Zhenjia Peng Rong Sun Zhe Li Yu Jiao Ning Zhang Qi Zhang Binbin Zhou Liyin Gao Xianzhu Fu Zhiquan Liu

纳米材料科学（英文版）2025，Vol.7Issue(4)：500-510,11.

纳米材料科学（英文版）2025，Vol.7Issue(4)：500-510,11.DOI:10.1016/j.nanoms.2024.07.001

Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers

Zhenjia Peng ¹Rong Sun ²Zhe Li ³Yu Jiao ⁴Ning Zhang ⁴Qi Zhang ⁵Binbin Zhou ³Liyin Gao ³Xianzhu Fu ⁶Zhiquan Liu²

作者信息

1. Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China||College of Materials Science and Engineering Shenzhen University,Shenzhen 518055,China
2. Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China||Shenzhen College of Advanced Technology,University of Chinese Academy of Sciences,Shenzhen 518055,China
3. Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China
4. Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China||Nano Science and Technology Institute,University of Science and Technology of China,Suzhou 215123,China
5. Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China||Guangdong-Hong Kong-Macau Joint Laboratory for Photonic-Thermal-Electrical Energy Materials and Devices,Institute of Applied Physics and Materials Engineering,University of Macau,Macao SAR 999078,China
6. College of Materials Science and Engineering Shenzhen University,Shenzhen 518055,China
折叠

摘要

关键词

Copper interconnect electroplating/Low aspect-ratio via fill/Additive ad/desorption and interactions/In situ Raman spectroelectrochemistry/Quantum chemical computation

Key words

Copper interconnect electroplating/Low aspect-ratio via fill/Additive ad/desorption and interactions/In situ Raman spectroelectrochemistry/Quantum chemical computation

引用本文复制引用

Zhenjia Peng,Rong Sun,Zhe Li,Yu Jiao,Ning Zhang,Qi Zhang,Binbin Zhou,Liyin Gao,Xianzhu Fu,Zhiquan Liu..Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers[J].纳米材料科学（英文版）,2025,7(4):500-510,11.

基金项目

This work was financially supported by Key-Area Research and Development Program of Guangdong Province(No.2023B0101040002),National Natural Science Foundation of China(Nos.62304143,52303092 and 62274172),and Guangdong Basic and Applied Basic Research Fund(No.2022B1515120037). （No.2023B0101040002）

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