标准科学Issue(z1)：200-205,6.
晶圆级再布线过程控制质量评价方法研究
Research on Quality Evaluation Methods for Process Control of Wafer-level Redistribution
汤朔 1齐筱 1刘昊文 1陈文浩 2孙晓冬2
作者信息
- 1. 中国电子技术标准化研究院
- 2. 中国电子科技集团有限公司第五十八研究所
- 折叠
摘要
Abstract
As a new packaging technology,wafer level ReDistribution Layer(RDL)package technology has the advantages such as shortening interconnection,reducing power consumption,and improving integration.It is the core technology of the current microsystems and multi-chip components processing,and can be used to realize the integration of new multifunctional devices and microsystems.This paper studies the manufacturing process of RDL,and analyzes the process monitoring and quality evaluation methods of RDL process,as well as the main defects and typical failure modes of RDL process,in order to lay a foundation for the enrichment and perfection of integrated circuits.关键词
晶圆级再布线/过程质量控制/可靠性Key words
redistribution layer/process control/reliability引用本文复制引用
汤朔,齐筱,刘昊文,陈文浩,孙晓冬..晶圆级再布线过程控制质量评价方法研究[J].标准科学,2025,(z1):200-205,6.
