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芯粒互联接口中多协议支持技术及标准化研究

何星洋 周宏伟 周雨萱 孙玉波 黎梦金

计算机工程与科学2025,Vol.47Issue(9):1521-1534,14.
计算机工程与科学2025,Vol.47Issue(9):1521-1534,14.DOI:10.3969/j.issn.1007-130X.2025.09.001

芯粒互联接口中多协议支持技术及标准化研究

Research on multi-protocol support technology and standardization in Chiplet interconnection interface

何星洋 1周宏伟 1周雨萱 1孙玉波 2黎梦金1

作者信息

  • 1. 国防科技大学计算机学院,湖南长沙 410073||国防科技大学先进微处理器芯片与系统重点实验室,湖南长沙 410073
  • 2. 长沙理工大学计算机与通信工程学院,湖南长沙 410114
  • 折叠

摘要

Abstract

Chiplet integration has emerged as an effective approach to overcoming the limitations of chip fabrication,memory bandwidth,power consumption,and scalability in the post-Moore era.Estab-lishing standardized Chiplet interconnection interfaces is a prerequisite for heterogeneous Chiplet integra-tion,significantly simplifying Chiplet adaptation,improving the reusability of Chiplets and interconnect interfaces,and accelerating multi-Chiplet SoC design.Since different types of Chiplets adopt varying protocol standards at the protocol layer,Chiplet interconnection interface must support multiple proto-cols.To address this,we propose a multi-protocol support technology based on broad categorization,di-viding protocols into two classes according to their packet characteristics:fixed-pattern protocols and stream-pattern protocols.This technology directly supports protocols conforming to these two catego-ries,while indirectly supporting non-conforming packet types through a"native mode".Additionally,it enables concurrent execution of any two protocols and provides enhanced support for CXL and UCIe.The technology improves indirect protocol support efficiency via micro-packet-level compatibility and achieves complete decoupling between the protocol and adapter layers by delegating link management in-formation embedding in data payloads to the protocol layer.Based on this,we designed a Chiplet inter-connection interface supporting concurrent PCIe and CXL.me protocols and established a simulation ver-ification environment.Experimental results confirm the feasibility and correctness of the proposed tech-nology in multi-protocol support and concurrent protocol execution.

关键词

芯粒集成/芯粒互联规范/芯粒互联接口/多协议支持技术/协议并发

Key words

Chiplet integration/Chiplet interconnect specification/Chiplet interconnection interface/multi-protocol support technology/multi-protocol concurrency

分类

信息技术与安全科学

引用本文复制引用

何星洋,周宏伟,周雨萱,孙玉波,黎梦金..芯粒互联接口中多协议支持技术及标准化研究[J].计算机工程与科学,2025,47(9):1521-1534,14.

基金项目

湖南省教育厅项目(XJCX2023169) (XJCX2023169)

计算机工程与科学

OA北大核心

1007-130X

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