材料工程2025，Vol.53Issue(9)：11-28,18.DOI:10.11868/j.issn.1001-4381.2025.000001
电子封装低温焊料研究进展
Research progress in low-temperature solders for electronic packaging
摘要
Abstract
The combination of multiple temperature gradients in interconnect solders is key to achieving high-density chip integration.Low-temperature solder alloys are the premise for implementing low-temperature processes and the guarantee for high reliability of electronic products.This article reviews the research progress in Sn-58Bi low-temperature solders,In-based(In-Sn,In-Pb,In-Ag,In-Bi)low-temperature solders,and other low-temperature solders(multicomponent alloys,high-entropy alloys,Ga-based alloys).It is pointed out that Sn-Bi solders containing Bi cannot avoid Bi segregation and brittle fracture.The optimal choice is to use mixed solders in the soldering process,utilizing other solders or adding particles to react with Bi to form Bi-containing compounds that consume Bi,without losing the weldability of Sn-Bi solders and matching existing reflow processes.In-based binary or multicomponent low-temperature solders and SnBiIn X high-entropy alloys will inevitably form brittle Bi phases and low-melting-point Bi-In or Sn-In compounds after soldering.It is advisable to abandon the use of Bi and control the content of Sn.For example,mixing low-melting-point Ga or In with high-melting-point Cu to form non-metallurgical mixed or composite solders,low-temperature transient liquid phase bonding realizes low-temperature interconnection near the melting temperature of low-melting-point components.The consumption of low-melting-point phases and the formation of high-melting-point compounds are the prerequisites for ensuring high strength of the solder joint and high-temperature service.关键词
互连焊料组合/低温焊料/高密度集成/先进封装Key words
interconnected solder combination/low-temperature solder/high-density integration/advanced packaging分类
矿业与冶金引用本文复制引用
李方樑,夏大权,徐向涛,甘贵生,窦俊丰,谢道春,朱俊雄,耿明利,韩军,杨栋华,潘浩..电子封装低温焊料研究进展[J].材料工程,2025,53(9):11-28,18.基金项目
国家自然科学基金资助项目(62274020) （62274020）
重庆市教委科技项目重大项目(KJZD-M202301102) （KJZD-M202301102）
重庆市技术创新与应用发展重大专项(CSTB2024TIAD-STX0011) （CSTB2024TIAD-STX0011）
