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A 2D/3D vision chip based on organic substrate 3D package

Siyuan Wei Quanmin Chen Jingyi Yu Xuanzhe Xu Yuxiao Wen Runjiang Dou Shuangming Yu Guike Li Kaiming Nie Jie Cheng Jiangtao Xu Liyuan Liu Nanjian Wu

Journal of Semiconductors2025,Vol.46Issue(10):P.25-33,9.
Journal of Semiconductors2025,Vol.46Issue(10):P.25-33,9.DOI:10.1088/1674-4926/25010030

A 2D/3D vision chip based on organic substrate 3D package

Siyuan Wei 1Quanmin Chen 2Jingyi Yu 3Xuanzhe Xu 1Yuxiao Wen 1Runjiang Dou 1Shuangming Yu 1Guike Li 1Kaiming Nie 2Jie Cheng 4Jiangtao Xu 2Liyuan Liu 5Nanjian Wu1

作者信息

  • 1. State Key Laboratory of Semiconductor Physics and Chip Technologies,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China College of Materials Science and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing 100049,China
  • 2. School of Microelectronics and Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology,Tianjin University,Tianjin 300072,China
  • 3. State Key Laboratory of Semiconductor Physics and Chip Technologies,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China School of Microelectronics and Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology,Tianjin University,Tianjin 300072,China
  • 4. SuperPix Micro Technology Co.,Ltd.,Beijing 100085,China
  • 5. State Key Laboratory of Semiconductor Physics and Chip Technologies,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China School of Electronic,Electrical and Communication Engineering,University of Chinese Academy of Sciences,Beijing 100049,China
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摘要

关键词

vision chip/2-D/3-D image processing/near-sensor computing/convolutional neural networks

分类

信息技术与安全科学

引用本文复制引用

Siyuan Wei,Quanmin Chen,Jingyi Yu,Xuanzhe Xu,Yuxiao Wen,Runjiang Dou,Shuangming Yu,Guike Li,Kaiming Nie,Jie Cheng,Jiangtao Xu,Liyuan Liu,Nanjian Wu..A 2D/3D vision chip based on organic substrate 3D package[J].Journal of Semiconductors,2025,46(10):P.25-33,9.

基金项目

supported in part by the National Key Research and Development Program of China(Grant No.2019YFB2204300) (Grant No.2019YFB2204300)

in part by the National Natural Science Foundation of China(Grant Nos.62334008 and 62274154) (Grant Nos.62334008 and 62274154)

in part by the Key Program of National Natural Science Foundation of China(Grant No.62134004). (Grant No.62134004)

Journal of Semiconductors

1674-4926

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