A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated,Uniform,Pain-Free Transdermal Delivery of Extracellular Vesicles
Minwoo Song Minji Ha Sol Shin Minjin Kim Soyoung Son Jihyun Lee Gui Won Hwang Jeongyun Kim Van Hieu Duong Jae Hyung Park Changhyun Pang
A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated,Uniform,Pain-Free Transdermal Delivery of Extracellular Vesicles
摘要
关键词
Biomimetics/Cupping/Microneedle/Transdermal patch/Extracellular vesicles分类
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Minwoo Song,Minji Ha,Sol Shin,Minjin Kim,Soyoung Son,Jihyun Lee,Gui Won Hwang,Jeongyun Kim,Van Hieu Duong,Jae Hyung Park,Changhyun Pang..A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated,Uniform,Pain-Free Transdermal Delivery of Extracellular Vesicles[J].Nano-Micro Letters,2026,18(1):P.268-289,22.基金项目
supported by National Research Foundation of Korea(NRF)grants funded by the Korean government(MSIT)(No.RS-2023-00256265,RS-2024-00352352,RS-2024-00405818) (NRF)
the Korean Fund for Regenerative Medicine(KFRM)grant funded by the Korea government(the Ministry of Science and ICT,the Ministry of Health&Welfare).(No.25A0102L1) (KFRM)
support from the Market-led K-sensor technology program(RS-2022-00154781,Development of large-area wafer-level flexible/stretchable hybrid sensor platform technology for form factor-free highly integrated convergence sensor),funded By the Ministry of Trade,Industry&Energy(MOTIE,Korea). (RS-2022-00154781,Development of large-area wafer-level flexible/stretchable hybrid sensor platform technology for form factor-free highly integrated convergence sensor)