铜业工程Issue(5)：42-51,10.DOI:10.3969/j.issn.1009-3842.2025.05.006
微量Ag元素对Cu-Ag合金抗软化性能的影响及机理分析
Mechanism Analysis of Trace Ag Content Change on Softening Resistance of Cu-Ag Alloy
摘要
Abstract
With the ongoing advancement of electronic components towards higher power,miniaturization,and enhanced reliability,the performance requirements for copper strips used in these components are also becoming increasingly stringent.Copper strips must not only maintain high electrical and thermal conductivity but also exhibit superior strength and resistance to softening.In this paper,char-acterization methods such as EBSD and TEM were employed to systematically investigate the influence of trace Ag(0.0013%～0.0208%)on the microstructure and anti-softening performance of Cu-Ag alloys.The research findings indicated that trace Ag can re-fine the microstructure of Cu-Ag alloys,significantly enhancing their mechanical properties at high temperatures and increasing soften-ing temperature.Specifically,the softening temperature of alloy with 0.0208%Ag(S4)reached 408℃,which was 80℃higher than that of alloy with lower Ag content(S1,0.0013%),and the hardness increased by approximately 26%.Trace Ag was solid-solved in the matrix,causing lattice distortion and significantly impeding the slip movement of dislocations,thereby effectively retarding the recrys-tallization process of the alloy.Additionally,the addition of trace Ag also exerted a pinning effect on the grain boundaries,significantly inhibiting grain growth and delaying the occurrence of recrystallization.The analysis revealed that recrystallization was the primary cause of the high-temperature softening phenomenon of the alloy.关键词
铜合金/Ag微合金化/抗软化/再结晶/Ag偏析Key words
copper alloy/Ag microalloying/anti-softening/recrystallization/Ag segregation分类
金属材料引用本文复制引用
王宛玉,王虎,郭慧稳,刘月梅..微量Ag元素对Cu-Ag合金抗软化性能的影响及机理分析[J].铜业工程,2025,(5):42-51,10.基金项目
国家重点研发计划项目(2023YFB3812601) （2023YFB3812601）
中铝重点研发计划项目(ZT2417)资助 （ZT2417）
