现代电子技术2025，Vol.48Issue(22)：1-7,7.DOI:10.16652/j.issn.1004-373x.2025.22.001
结合多通孔的超导接地共面波导传输线的仿真
Simulation of superconducting ground coplanar waveguide transmission lines with multi-through-silicon via
摘要
Abstract
In superconducting quantum computing,augmenting the quantity of qubits is one of the efficacious approaches to enhance the performance of quantum computers.With the number of qubits rises,the wiring of qubit control lines on single chip will become highly challenging.Currently,a potential solution is to introduce a through-silicon via structure on the chip,lay out the quantum bits and control lines in layers,and realize the transmission of microwave signals between through-silicon viacomponents.The research on through-silicon via transmission model aims to realize the vertical transmission of microwave signals between different layers of superconducting quantum circuit and provide support for the layered layout of quantum components.The transmission behavior of through-silicon via is analyzed by means of microwave transmission theory,and a two-dimensional cross-section model encompassing multi-through-silicon via is designed.After the simulation experiments of different through-silicon via sizes,shapes and spacing between inner and outer through-silicon via,the through-silicon via cross-section model with multiple impedance matching is obtained.On this basis,the verification scheme of superconducting ground coplanar waveguide transmission line combined with a characteristic impedance of 50 Ω is proposed.The experimental results demonstrate that the designed through-silicon via transmission model can realize excellent impedance matching,thereby verifying that the design method is effective and feasible,and offering an effective reference for the design of the through-silicon via module in the multi-layer architecture of the superconducting quantum chip.关键词
超导量子计算/超导量子芯片/硅通孔/共面波导/阻抗匹配/传输线Key words
superconducting quantum computation/superconducting quantum chip/through-silicon via/grounded coplanar waveguide/impedance matching/transmission line分类
信息技术与安全科学引用本文复制引用
刘星江,樊凯哲,王卫龙,穆清,张梦凡,张潮洁,杨天,袁本政,何昊冉,冯薛飞,查治国,刘佳宁..结合多通孔的超导接地共面波导传输线的仿真[J].现代电子技术,2025,48(22):1-7,7.基金项目
河南省重大科技专项(221100210400) （221100210400）
