广东工业大学学报2025，Vol.42Issue(6)：1-11,11.DOI:10.12052/gdutxb.250119
我国集成电路关键技术挑战与协同创新路径
Key Technological Challenges and Collaborative Innovation Pathways of China's Integrated Circuits
摘要
Abstract
Against the backdrop of intensified global technological rivalry and restrictions on critical technologies,the Integrated Circuit(IC)industry has become central domain of national strategic security and technological self-reliance.This paper systematically reviews the development status of China's IC industry chain,focusing on key bottlenecks in design,manufacturing,Electronic Design Automation(EDA)tools,and advanced packaging.Based on an analysis of external pressures such as U.S.-led technology embargoes and internal structural weaknesses,the authors identify the dual challenges faced by the industry.Combined with the latest research practice in Artificial Intelligence(AI)hardware accelerators,hardware/software co-design,device modeling and simulation,and AI-assisted EDA,this paper proposes a technology breakthrough path driven by collaborative innovation,and explores new directions in computing architecture,system packaging,and EDA design under the post-Moore paradigm.This paper provides theoretical support and practical references for technological innovation and policy formulation in the integrated circuit field.关键词
集成电路/软硬件协同设计/器件建模与仿真/EDA工具/后摩尔时代Key words
integrated circuits/hardware/software co-design/device modeling and simulation/EDA tools/post-Moore era分类
计算机与自动化引用本文复制引用
熊晓明,詹瑞典,饶博,郑欣,刘远..我国集成电路关键技术挑战与协同创新路径[J].广东工业大学学报,2025,42(6):1-11,11.基金项目
广东省自然科学基金资助面上项目(2025A1515010110) （2025A1515010110）
