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基于电-磁-热耦合的半导体桥热爆安全性数值研究

马佳旭 封锋 段佳宁 张晓 高博

含能材料2025,Vol.33Issue(11):1333-1340,8.
含能材料2025,Vol.33Issue(11):1333-1340,8.DOI:10.11943/CJEM2025063

基于电-磁-热耦合的半导体桥热爆安全性数值研究

Numerical Study on Thermal Explosion Safety of Semiconductor Bridge Based on Electro-magnetic-thermal Coupling

马佳旭 1封锋 1段佳宁 1张晓 1高博2

作者信息

  • 1. 南京理工大学 机械工程学院 特种动力技术教育部重点实验室,江苏 南京 210094
  • 2. 华东光电集成器件研究所,安徽 蚌埠 233030
  • 折叠

摘要

Abstract

In order to meet the dual constraint requirements of safety current and anti-electromagnetic radiation power of semi-conductor bridge initiating explosive devices,based on GJB 344A-2020'General specification for insensitive electric initiators':Non-fire test standard,the electro-magnetic-thermal multi-physical field coupling model was constructed on COMSOL Multi-physics platform by numerical simulation method.By integrating the parallel shunt mechanism of negative temperature coeffi-cient(NTC)thermistor,the loop resistance was monitored in real time and the current input was dynamically compensated.The effects of thermal safety under three working conditions of constant current 1A,constant power 1 W and double constraints 1A1W were compared and analyzed.The results show that the power of 1 A constant current condition is only 0.78 W,which deviates from the standard by 22%because the loop resistance is reduced to 0.78 Ω.The initial current of 1W constant power condition is 0.91 A,which is lower than the safety threshold.The dynamic adjustment strategy realizes the coordinated stability of current and power through closed-loop control.The heat balance temperature of the bridge area is controlled at 449.06 K,and the shunt rate is increased from 29%to 41.26%compared with the 1A constant current condition,and the shunt rate is in-creased by 0.6%compared with the 1 W constant power condition.

关键词

半导体桥/火工品/安全电流/COMSOL仿真/NTC热敏电阻/多物理场耦合

Key words

semiconductor bridge/initiating devices/safety current/COMSOL simulation/negative temperature coefficient therm-istor/multiphysics coupling

分类

武器工业

引用本文复制引用

马佳旭,封锋,段佳宁,张晓,高博..基于电-磁-热耦合的半导体桥热爆安全性数值研究[J].含能材料,2025,33(11):1333-1340,8.

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