广东电力2025，Vol.38Issue(11)：103-111,9.DOI:10.3969/j.issn.1007-290X.2025.11.011
测试条件对压接式IGBT模块热阻的影响
Effect of Test Conditions on Thermal Resistance of Press-pack IGBT Modules
摘要
Abstract
Accurate measurement of the thermal resistance of press-pack IGBT modules(PP-IGBT)is of great importance for evaluating their heat dissipation performance,thermal reliability,and lifetime.However,the thermal resistance measurement is strongly affected by various external conditions,and the underlying influencing mechanisms are complex,making it difficult to obtain repeatable and accurate results.Therefore,this study systematically investigates the influence and sensitivity of typical test conditions on thermal resistance measurement of press-pack IGBT modules,with the objective of establishing a repeatable and comparable standardized testing method.Firstly,the on-state voltage drop at a small collector current is adopted as a temperature-sensitive electrical parameter(TSEP)for thermal resistance measurement.Six key test parameters are selected for analysis,including the contact pressure on both sides of the module,gate voltage,coolant temperature,coolant flow rate,heating current and measurement current.Based on the control variable method,transient thermal resistance tests are designed and conducted for each of these parameters.The measured results are further validated using finite element analysis(FEA)and structure function methods,while the influence of each parameter on the measurement accuracy is analyzed.The test results show that under normal operating conditions,the gate voltage and coolant flow rate have negligible effects on the measured thermal resistance,and gate voltage ideally has no influence at all.In contrast,the contact pressure,coolant temperature,heating current and measurement current significantly affect the measurement results through changes in heat dissipation paths and internal thermal coupling.Among them,contact pressure exhibits the most pronounced impact on the measuring results.关键词
压接式IGBT模块/热阻/有限元仿真/温敏电参数/结构函数Key words
press-pack IGBT module/thermal resistance/finite element simulation/temperature-sensitive electrical parameter/structure function分类
信息技术与安全科学引用本文复制引用
颜小雪,沈洋羿,廖宇,李盈,郭清,张军明..测试条件对压接式IGBT模块热阻的影响[J].广东电力,2025,38(11):103-111,9.基金项目
中国南方电网有限责任公司科技项目(GDKJXM20222550) （GDKJXM20222550）
