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基于压电喷墨打印技术的多层电路垂直互连工艺研究

林枝城 加泽贤 苟宁 孙岩辉 吕景祥 尹恩怀 李超

工程设计学报2025,Vol.32Issue(6):780-788,9.
工程设计学报2025,Vol.32Issue(6):780-788,9.DOI:10.3785/j.issn.1006-754X.2025.05.131

基于压电喷墨打印技术的多层电路垂直互连工艺研究

Research on vertical interconnect process of multilayer circuits based on piezoelectric inkjet printing technology

林枝城 1加泽贤 1苟宁 2孙岩辉 1吕景祥 1尹恩怀 2李超2

作者信息

  • 1. 长安大学 道路施工技术与装备教育部重点实验室,陕西 西安 710064
  • 2. 西安瑞特三维科技有限公司,陕西 西安 710068
  • 折叠

摘要

Abstract

To investigate the application of piezoelectric inkjet printing technology in vertical interconnect processes for multilayer circuits,a composite additive-subtractive forming process for vertical interconnection holes is proposed.This process employed mechanical drilling and laser drilling techniques to create blind holes in interconnection circuits,followed by precise filling of these holes using piezoelectric inkjet printing technology,successfully achieving the fabrication of double-layer and four-layer vertical interconnection circuits.The experimental results showed that the interconnection holes formed by the laser drilling technique exhibited inclined pore walls,with the cured nano-silver ink forming a conical distribution and voids appearing within the filled holes.In contrast,the interconnection holes fabricated by mechanical drilling technique maintained good perpendicularity of pore walls,enabling the cured nano-silver ink to form tight and uniform connections with each circuit layer,free of defects such as voids or pores.All fabricated interconnection samples successfully achieved electrical conductivity between each circuit layer,and the average resistance of each circuit layer was less than 1.70 Ω.The composite additive-subtractive forming process for vertical interconnection holes,which integrates mechanical drilling,laser drilling and piezoelectric inkjet printing technology,provides a viable solution for vertical interconnections between multilayer circuits.

关键词

压电喷墨打印/多层电路/互连孔/垂直互连/增减材复合成形

Key words

piezoelectric inkjet printing/multilayer circuits/interconnection hole/vertical interconnection/composite additive-subtractive forming

分类

信息技术与安全科学

引用本文复制引用

林枝城,加泽贤,苟宁,孙岩辉,吕景祥,尹恩怀,李超..基于压电喷墨打印技术的多层电路垂直互连工艺研究[J].工程设计学报,2025,32(6):780-788,9.

基金项目

国家重点研发计划项目(2022YFB4602800) (2022YFB4602800)

工程设计学报

OA北大核心

1006-754X

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