流体机械2025，Vol.53Issue(11)：44-51,8.DOI:10.3969/j.issn.1005-0329.2025.11.006
基于泡沫金属与多孔肋结构下的芯片散热器换热效果研究
Study on heat transfer effect of chip heat sink based on metal foam and porous rib structure
摘要
Abstract
To address the issue of insufficient heat transfer efficiency in traditional heat sinks caused by increasing chip power density,a novel chip heat sink based on the synergistic effect of metal foam and porous ribs is proposed.Through numerical simulation,a 3D composite structure was constructed(using metal foam as the background area and porous ribs as discrete arrays in hotspot areas),with peak temperature,temperature difference,pressure drop,and equivalent thermal resistance as evaluation indicators,comparing the performance of the new heat sink with traditional metal foam heat sinks and porous rib heat sinks.The results show that under the conditions of coolant inlet flow velocity of 0.1～0.4 m/s and porosity of 0.8,the new heat sink has the lowest peak temperature(36℃,2℃lower than the metal foam heat sink and 1℃lower than the porous rib heat sink),the smallest temperature difference(3℃,1℃and 4℃lower than the former two respectively),and the lowest equivalent thermal resistance(1.3 K/W,7.1%and 10.3%lower than the former two respectively);its pressure drop increase(300%)is lower than that of the porous rib heat sink(330%)and metal foam heat sink(302%),proving that the multi-scale synergistic effect of metal foam and porous ribs can effectively improve heat dissipation performance.The research can provide references for the design of heat sinks for high-power density chips.关键词
散热器/多孔结构/微电子芯片/数值模拟Key words
heat sink/porous structure/microelectronic chip/numerical simulation分类
能源科技引用本文复制引用
DING Houcheng,SHAO Mengsheng,DENG Quanlong,FENG Junjun,XU Yingying..基于泡沫金属与多孔肋结构下的芯片散热器换热效果研究[J].流体机械,2025,53(11):44-51,8.基金项目
国家自然科学基金项目(52104175) （52104175）
中国博士后科学基金项目(2022M712935) （2022M712935）
省级大学生创新创业项目(S202410360224) （S202410360224）
