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高纯金及金靶材制备工艺研究进展

NING Rui LIU Zhizhong MA Dengfeng LI Wei CHEN Song YIN Yanxi

铜业工程Issue(6):73-84,12.
铜业工程Issue(6):73-84,12.DOI:10.3969/j.issn.1009-3842.2025.06.008

高纯金及金靶材制备工艺研究进展

Recent Developments in Preparation Process of High-Purity Gold and Gold Tar-get Materials

NING Rui 1LIU Zhizhong 1MA Dengfeng 1LI Wei 1CHEN Song 2YIN Yanxi2

作者信息

  • 1. Daye Nonferrous Metals Co.,Ltd.,Huangshi 435005,China||Key Laboratory of Nonferrous Metals Metallurgy and Recycling in Hubei Province,Huangshi 435002,China
  • 2. GRINM Resources and Environment Tech.Co.,Ltd.,Beijing 101407,China||General Research Institute for Nonferrous Metals,Beijing 100088,China||National Engineering Research Center for Environment-Friendly Metallurgy in Producing Premium Non-Ferrous Metals,GRINM Group Corporation Limited,Beijing 100088,China||Beijing Engineering Research Center of Strategic Nonferrous Metals Green Manufacturing Technology,Beijing 100088,China
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摘要

Abstract

High-purity gold(Au)and gold targets are among the fundamental raw materials for integrated circuit and semiconductor chip manufacturing,primarily used in metallization systems of high-end chips and advanced packaging.In order to protect the supply chain security of China's high-end chips,Chinese enterprises are constantly devoted to the research and development and industrialization of high-purity gold and gold target preparation technology.This paper outlined the technical requirements and preparation challenges of high-purity gold and gold targets for semiconductor applications,providing an overview of global preparation technologies and research advancements,and analyzed the advantages and disadvantages of various methods.In the preparation of high-purity gold,the direct chemical reduction method features short processing flow and high efficiency but suffers from unstable product quality.The solvent extraction-reduction method ensures stable quality and high purity yet causes severe environmental pollution.The electrolysis method delivers high quality and purity with low cost but requires extended production cycles.The primary method for preparing gold targets was the melting-thermomechanical processing method,which achieved an average grain size of less than 100 μm in the resulting products.The preparation of high purity gold and gold target for semiconductor chips must be combined with the advantages of various purification processes and adopt a variety of combined processes in order to stably remove specific impurities and meet the high purity gold standard for semiconductors.

关键词

半导体/高纯金/靶材/还原法/溶剂萃取/电解

Key words

semiconductor/high-purity gold/target material/reduction method/solvent extraction/electrolysis

分类

矿业与冶金

引用本文复制引用

NING Rui,LIU Zhizhong,MA Dengfeng,LI Wei,CHEN Song,YIN Yanxi..高纯金及金靶材制备工艺研究进展[J].铜业工程,2025,(6):73-84,12.

基金项目

广西重点研发计划项目(桂科AB25069474) (桂科AB25069474)

中国有色集团科技计划项目(2022KJJH08)资助 (2022KJJH08)

铜业工程

1009-3842

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