LI Sheng-bin 1YANG Peng-fei2
作者信息
- 1. The 43th Research Institute of China Electronics Technology Group Corporation,Hefei 230088,China
- 2. Hefei Shengda Electronic Technology Industry Co.,Ltd.,Hefei 230061,China
- 折叠
摘要
Abstract
As the semiconductor industry enters the"Post-Moore era",advanced packaging technologies,centered on heterogeneous integration and 3D packaging,have become the key driving force for sustaining techno-logical development.Under this background,through-glass via(TGV)technology has garnered widespread industry attention as a highly promising novel platform technology.It is not only crucial for manufacturing glass interposers but also fundamental for the glass core substrate(GCS).This paper provides a systematic review of the status and development of TGV technology.Firstly,the strategic importance of TGV technology in advanced packaging is e-laborated,and the technology is compared with silicon-based and organic-based interposer technologies from the perspectives of performance and cost.Then a detailed analysis of the core manufacturing processes for TGV sub-strates is provided,with a focus on various via formation methods for example the laser-induced deep etching(LIDE)and subsequent metallization techniques.And then,the facing thermomechanical reliability challenges of the technology,such as cracking and warpage issues caused by thermal stress,are systematically investigated and the corresponding solutions are explored.Finally,the application examples and prospects of TGV technology in the fields such as advanced packaging,micro-electro-mechanical systems(MEMS),radio frequency(RF)devices,opti-cal modules,and thermal management are outlined.This paper aims to provide comprehensive technical references for researchers and engineers in related fields.关键词
玻璃通孔/先进封装/玻璃转接板/玻璃芯板/异构集成/可靠性Key words
Through-glass via/Advanced packaging/Glass interposer/Glass core substrate/Heterogeneous in-tegration/Reliability分类
信息技术与安全科学
