重庆科技大学学报（自然科学版）2025，Vol.27Issue(6)：49-58,10.DOI:10.19406/j.issn.2097-4531.2025.06.006
废旧印刷电路板非金属粉填充改性高密度聚乙烯结构与性能研究
Study on Structure and Properties of High-Density Polyethylene Modified by Non-Metallic Powder From Waste Printed Circuit Boards
摘要
Abstract
The development of informatization and intensified market competition have led to frequent updates of e-lectronic devices,resulting in a dramatic increase in the amount of electronic waste.Waste printed circuit boards(WPCB)are the main source of secondary pollution in recycling.Due to their extreme difficulty in degradation,they are often disposed of by landfilling or incineration.However,landfilling can pollute soil and groundwater,while incineration produces a large amount of harmful gases and carcinogens.Currently,no scientific recycling method has been found,especially for the treatment and utilization of their non-metallic flour(NMF)remains an urgent international technical problem to be solved.In this study,waste NMF is adopted to fill and modify high-density polyethylene(HDPE).Through mechanical property testing and scanning electron microscopy analysis,the effects of NMF obtained by different sieving methods on the properties of composites are investigated.The results indicate that the composite material obtained through secondary sieving exhibited superior mechanical properties.Based on these findings,the influence of the amount and particle size of NMF on the overall performance of the HDPE composite material is further investigated.Research indicates that when the dosage is 10％,the HDPE com-posite exhibits optimal comprehensive mechanical properties;when sieved through 60-80 mesh,the Vicat softening temperature of the HDPE composite reaches 86.8℃;the addition of NMF reduces the fluidity of the HDPE composite,with the system sieved through 20-40 mesh showing the best fluidity,achieving a melt flow rate of 5.52 g/10 min.关键词
废旧印刷电路板非金属粉/二次过筛/HDPE/力学性能Key words
non-metallic flour from waste printed circuit board/secondary sieve/high-density polyethylene/me-chanical properties分类
化学化工引用本文复制引用
田生慧,李林,黄迪,李雨霏,韩超,张磊,李权,陈泽军..废旧印刷电路板非金属粉填充改性高密度聚乙烯结构与性能研究[J].重庆科技大学学报（自然科学版）,2025,27(6):49-58,10.基金项目
重庆市教育委员会科学技术研究计划青年项目"趋海塑料r-PET高强度合金研制及其生命周期评估"(202401527) （202401527）
重庆市大学生科技创新训练计划项目"植物纤维改性PBAT全生物基复合材料开发与应用"(S202511551042) （S202511551042）
