舰船电子工程2025，Vol.45Issue(11)：157-161,5.DOI:10.3969/j.issn.1672-9730.2025.11.033
MEMS倒装式压力传感器失效分析
Failure Analysis of MEMS Inverted Pressure Sensor
摘要
Abstract
In response to the problems encountered during the testing process of MEMS inverted pressure sensors,this paper analyzes the correlation between pressure sensor faults and chip design,chip preparation,and integrated sensor packaging,provid-ing reference for preventive maintenance and failure analysis of pressure sensors.This article selects sensor chips successfully re-searched by the research group from 2021 to 2022,and packages them into integrated sensors.This paper analyzies the problems that occurred during testing and repairs their faults.The results show that the metal point electrodes in the glass through-hole of the inverted pressure sensor are warped after long-term operation,forming a fault with the surrounding sputtered metal and causing a circuit breaker.The through-hole is repaired by filling it with conductive slurry,and the repaired sensor's lifespan is greatly extend-ed under working conditions.This article proposes a complete failure analysis process for an inverted pressure sensor,and effective-ly analyzes the fault distribution and reliability of the sensor,providing a reference for developing targeted preventive maintenance plans.关键词
倒装式压力传感器/故障/失效分析/问题修复/修复测试Key words
inverted pressure sensor/fault/failure analysis/problem fixing/repair testing分类
信息技术与安全科学引用本文复制引用
党伟刚,王瑞,刘东,梁庭,雷程..MEMS倒装式压力传感器失效分析[J].舰船电子工程,2025,45(11):157-161,5.基金项目
国家重点研发计划(编号:2023YFB3209100) （编号:2023YFB3209100）
中央引导地方科技发展资金项目(编号:YDZJSX20231B006)资助. （编号:YDZJSX20231B006）
