现代信息科技2026，Vol.10Issue(2)：43-47,5.DOI:10.19850/j.cnki.2096-4706.2026.02.008
电子控制组件的散热与力学设计分析
Thermal Dissipation and Mechanical Design Analysis of Electronic Control Components
杨宁宁 1扈光涛 1李奇 1魏猛2
作者信息
- 1. 四川航天电子设备研究所,四川 成都 610199
- 2. 空天多源信息智能融合四川省重点实验室,四川 成都 610100
- 折叠
摘要
Abstract
With the widespread application of hot-swappable electronic control components in integrated systems,the requirements of the systems for their performance and reliability become increasingly stringent.Efficient thermal dissipation and mechanical performance optimization of electronic control components are the key to ensuring their reliability and long service life.To address this issue,thermal dissipation and structural design of electronic control components are carried out.Taking the airborne drive module as an example,this paper introduces the overall design method of the module,adopts the ANSYS finite element software to simulate and analyze the temperature distribution state of the model under the overall environmental requirements as well as the stress and deformation states under mechanical vibration and shock.The simulation results meet the overall design requirements,verify the effectiveness of the structure,and provide important design references for the structural design of electronic control components.关键词
控制组件/结构设计/热仿真/力学仿真Key words
control component/structural design/thermal simulation/mechanical simulation分类
信息技术与安全科学引用本文复制引用
杨宁宁,扈光涛,李奇,魏猛..电子控制组件的散热与力学设计分析[J].现代信息科技,2026,10(2):43-47,5.
