首页|期刊导航|Industrial Chemistry & Materials|On-line detection of additive concentrations in acidic copper plating solution for metal interconnection by an electrochemical microfluidic workstation
On-line detection of additive concentrations in acidic copper plating solution for metal interconnection by an electrochemical microfluidic workstation
Yi Zhao Ju-Xing Zeng Jia-Qiang Yang Tao Song Ren Hu Jian-Jia Su Bo Zhang Fang-Zu Yang Dongping Zhan Lianhuan Han
Industrial Chemistry & Materials2025,Vol.3Issue(5):P.607-617,11.
Industrial Chemistry & Materials2025,Vol.3Issue(5):P.607-617,11.DOI:10.1039/d5im00073d
On-line detection of additive concentrations in acidic copper plating solution for metal interconnection by an electrochemical microfluidic workstation
摘要
关键词
Electrochemical microfluidic workstation/On-line detection of additive concentration/Microfluidic chip/Ultramicroelectrode/Acidic copper electroplating分类
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Yi Zhao,Ju-Xing Zeng,Jia-Qiang Yang,Tao Song,Ren Hu,Jian-Jia Su,Bo Zhang,Fang-Zu Yang,Dongping Zhan,Lianhuan Han..On-line detection of additive concentrations in acidic copper plating solution for metal interconnection by an electrochemical microfluidic workstation[J].Industrial Chemistry & Materials,2025,3(5):P.607-617,11.基金项目
the National Natural Science Foundation of China(22132003,22202166) (22132003,22202166)
National Key Research and Development Program of China(2023YFF0713900). (2023YFF0713900)