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Molecular topology-driven benzocyclobutenebased ultralow dielectrics with copper-matched low thermal expansion

Menglu Li Linfeng Fan Quan Sun Meng Xie Jin Guo Wenxin Fu

Industrial Chemistry & Materials2025，Vol.3Issue(5)：P.596-606,11.

Industrial Chemistry & Materials2025，Vol.3Issue(5)：P.596-606,11.DOI:10.1039/d5im00051c

Molecular topology-driven benzocyclobutenebased ultralow dielectrics with copper-matched low thermal expansion

Menglu Li ¹Linfeng Fan ²Quan Sun ¹Meng Xie ¹Jin Guo ³Wenxin Fu¹

作者信息

1. Key Laboratory of Science and Technology on High-Tech Polymer Materials,Institute of Chemistry,Chinese Academy of Sciences,Beijing 100190,China University of Chinese Academy of Sciences,Beijing 100049,China
2. Beijing Institute of Space Long March Vehicle,Beijing 100076,China China Academy of Launch Vehicle Technology,Beijing 100076,China
3. State Key Laboratory of Polymer Physics and Chemistry,Institute of Chemistry,Chinese Academy of Sciences,Beijing 100190,China University of Chinese Academy of Sciences,Beijing 100049,China
折叠

摘要

关键词

Benzocyclobutene/Ultralow dielectric constant/Low thermal expansion/Tri-armed monomer/Branched polymers

分类

化学化工

引用本文复制引用

Menglu Li,Linfeng Fan,Quan Sun,Meng Xie,Jin Guo,Wenxin Fu..Molecular topology-driven benzocyclobutenebased ultralow dielectrics with copper-matched low thermal expansion[J].Industrial Chemistry & Materials,2025,3(5):P.596-606,11.

基金项目

supported by the National Natural Science Foundation of China(No.52373316,22075298). （No.52373316,22075298）

Industrial Chemistry & Materials

ISSN：2755-2608

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