人工晶体学报2026，Vol.55Issue(1)：13-28,16.DOI:10.16553/j.cnki.issn1000-985x.2025.0076
光伏硅片切割技术研究进展
Research Progress of Photovoltaic Silicon Wafer Cutting Technology
摘要
Abstract
Taking the photovoltaic silicon wafer cutting technology as the research object,through literature review and comparative analysis,the main types of cutting technologies such as outer circle cutting,inner circle cutting,multi-wire cutting,electrical discharge cutting and compound cutting are introduced in detail,and their advantages and disadvantages are compared from multiple dimensions such as cutting accuracy,cutting loss and cutting efficiency.The research conclusion indicates that the multi-wire cutting technology has become the mainstream method for silicon wafer cutting and processing due to its high economic benefits,ability to cut large-sized silicon ingots,and shallow crystal defect depth.The composite cutting technology is expected to be the future development trend with its advantages of high cutting efficiency,high customizability,and low loss.关键词
多线切割/复合切割/光伏硅片/电火花切割/内圆切割/外圆切割Key words
multi-wire cutting/compound cutting/photovoltaic silicon wafer/electrical discharge cutting/internal circle cutting/external circle cutting分类
信息技术与安全科学引用本文复制引用
高邦志,黄天奇,吴纪清,杨军,许晖,张铭..光伏硅片切割技术研究进展[J].人工晶体学报,2026,55(1):13-28,16.基金项目
国家重点研发计划(2023YFB4204600) （2023YFB4204600）
