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基于JIT精益生产的半导体设备调度系统设计

刘伽利 许佳 张晔 李智炜 于红旗 刘海军

集成电路与嵌入式系统2026,Vol.26Issue(3):7-19,13.
集成电路与嵌入式系统2026,Vol.26Issue(3):7-19,13.DOI:10.20193/j.ices2097-4191.2025.0119

基于JIT精益生产的半导体设备调度系统设计

Design of semiconductor equipment scheduling system based on JIT lean production

刘伽利 1许佳 1张晔 1李智炜 1于红旗 1刘海军1

作者信息

  • 1. 国防科技大学 电子科学学院,长沙 410073
  • 折叠

摘要

Abstract

Semiconductor equipment is a critical component in chip manufacturing,performing essential processes such as lithography,etching,and thin-film deposition.The efficiency of its scheduling directly impacts wafer production capacity and factory profitability.Therefore,designing an efficient and stable scheduling system is crucial for achieving optimal production output.On one hand,the high-precision,multi-step wafer processing procedures increase the complexity of designing equipment scheduling systems.On the other hand,the efficiency of wafer scheduling within the equipment directly affects production capacity,imposing stringent requirements on the system's computational efficiency.Traditional scheduling design methods,often based on genetic algorithms that search for optimal solutions within the solution space,struggle to meet real-time system demands.This study systematically analyzes five scheduling con-straints in dual-cluster wafer processing semiconductor equipment:wafer discharge constraints,module usage constraints,prohibition of overloading,valve mutual exclusion constraints,and Just in Time requirements.Innovatively,the task scheduling problem for the pro-cessing chamber task pool and the robotic arm task pool is formulated as a Mixed Integer Programming(MIP)model.By leveraging the mathematical programming solver Gurobi for rapid solution,this approach achieves a computational speed improvement of an order of magnitude compared to traditional algorithms.

关键词

多晶圆类型/共享加工腔/驻留约束/集束型设备群

Key words

multiple wafer types/shared processing model/residency constraints/cluster tools

分类

信息技术与安全科学

引用本文复制引用

刘伽利,许佳,张晔,李智炜,于红旗,刘海军..基于JIT精益生产的半导体设备调度系统设计[J].集成电路与嵌入式系统,2026,26(3):7-19,13.

集成电路与嵌入式系统

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