中国电机工程学报2026，Vol.46Issue(2)：744-755,中插25,13.DOI:10.13334/j.0258-8013.pcsee.241428
一种DS型功率半导体模块的低应力弹性压接封装模型与模拟
A Low-stress Elastic Press-pack Model and Simulation for DS Type Power Semiconductor Modules
摘要
Abstract
This article proposes a new electrode technology for reversed S(DS)type press packing module,which integrates electrical and thermal conductivity,elasticity,and low inductance.It combines the elasticity of disc spring components with the electrical conductivity,thermal conductivity,and low inductance of convex rigid electrodes.Based on the new DS type electrode,a basic structural form,simulation model,manufacturing process,and material selection of a low-stress elastic press-pack power module are designed.A detailed introduction is given to the model and the multi-physics simulation,manufacturing process,voltage resistance and static performance testing of a new single-chip module designed based on 4500V silicon-based IGBT and fast recovery diode(FRD)chips.Preliminary test results show that the single-chip module based on DS type elastic electrodes has good comprehensive press-pack performance and can provide a basic electrode model for the packaging design of 4500V/3000A and higher rated modules in the future.关键词
功率半导体/模块/低应力/弹性压接/模型/模拟Key words
power semiconductor/module/low stress/elastic press pack/model/simulation分类
信息技术与安全科学引用本文复制引用
李现兵,韩佳桐,姚鹏,岳瑞峰,王燕,赵艳鹏,吴鹏飞,孙帅,杨霏..一种DS型功率半导体模块的低应力弹性压接封装模型与模拟[J].中国电机工程学报,2026,46(2):744-755,中插25,13.基金项目
北京市科委重点支持项目(Z201100004020002).Beijing Municipal Science & Technology Commission Important Research Program(Z201100004020002). （Z201100004020002）
