制冷学报2026，Vol.47Issue(1)：20-36,17.DOI:10.12465/issn.0253-4339.20251011001
高功率大面积AI芯片液冷技术进展
Research Progress on Liquid Cooling Technologies for High-Power and Large-Area AI Chips
摘要
Abstract
With advances in artificial intelligence(AI),massive computing demands have driven the development of AI chips.In particular,the recently proposed chiplet technology provides an advanced chip packaging and integration solution that offers high computing performance at a high yield rate and low cost,thus delivering solid hardware support for AI development.Chiplet-based chips are characterized by large area and high heat power,and their 3D chip stacking design leads to cooling challenges such as non-uniform heat flux distribution,long heat conduction paths for multilayer chips,and relatively thick thermal interface materials.These thermal issues are key bottlenecks limiting chip performance,making efficient chiplet thermal management a critical challenge in AI development.The progress in advanced liquid cooling technologies,including single-and two-phase liquid cooling solutions,is reviewed.Based on the cooling architecture,liquid cooling solutions can be categorized as cold-plate,near-junction-region,and immersion liquid cooling.In addition,the heat dissipation challenges and cooling strategies in 2.5D and 3D chiplets are summarized,providing a reference for the application and development of liquid cooling technologies for high-power,large-area AI chips.关键词
人工智能/Chiplet技术/芯片热管理/单相液冷/两相液冷Key words
artificial intelligence/Chiplet/chip thermal management/single-phase liquid cooling/two-phase liquid cooling分类
能源科技引用本文复制引用
邹启凡,刘洪,罗海亮,杨荣贵..高功率大面积AI芯片液冷技术进展[J].制冷学报,2026,47(1):20-36,17.基金项目
国家自然科学基金(T2588301&52036002)资助项目.(The project was supported by the National Natural Science Foundation of China(No.T2588301&No.52036002).)本文受北京市自然科学基金联合重点项目(L257012)资助.(The project was supported by the Beijing Municipal Natural Science Foundation (No. L257012). ) （T2588301&52036002）
