复合材料科学与工程Issue(2)：58-64,7.DOI:10.19936/j.cnki.2096-8000.20260228.008
有机硅改性热固性酚醛树脂的合成及应用研究
Synthesis and application of silicone modified thermosetting phenolic resin
摘要
Abstract
In this paper,3-isocyanatopropyl triethoxysilane(KH-907)was employed as a modifier,while phenol and formaldehyde served as monomer raw materials.The intermediate of N-(3-triethoxysilylpropyl)phenyl carbamate was synthesized by controlling the conditions of the addition reaction.Subsequently,this intermediate re-acted with formaldehyde under the catalysis of an alkaline catalyst,successfully synthesizing the organosilicon-mod-ified phenolic resin liquid(IPTES-PF).The chemical structure and curing behavior of the modified phenol-formal-dehyde(PF)were investigated via fourier transform infrared spectroscopy(FTIR)and differential scanning calo-rimetry(DSC).The effects of the addition amount of organosilicon and the material ratio on the mechanical proper-ties and thermal stability of the modified PF were studied through mechanical property tests and thermogravimetric(TG)analysis.The results indicated that the introduction of KH-907 enhanced the heat resistance of PF.Moreo-ver,as the content of the modifier KH-907 and the molar ratio of formaldehyde increased,the mechanical proper-ties of the organosilicon-modified PF initially rose and then declined.When the content of KH-907 was 15％and the molar ratio of phenol to formaldehyde was 1:1.8,the mechanical properties of the organosilicon-modified PF resin liquid were optimal,with a tensile shear strength of 7.06 MPa and a peel strength of 328 N/5 cm.The impact strength of the silicone modified PF composite and the grinding ratio of the consolidated abrasive tool reach the maxi-mum when the content of KH-907 is 15％,which are 2.87 kJ/m2 and 20.913,respectively.关键词
酚醛树脂/热固性/有机硅改性/耐热性能/力学性能/复合材料Key words
phenolic resin/thermosetting/silicone modification/heat resistance/mechanical property/com-posites分类
通用工业技术引用本文复制引用
赵聪聪,冯佳佳,安坤华,李雪雪,刘聪,张琳琪..有机硅改性热固性酚醛树脂的合成及应用研究[J].复合材料科学与工程,2026,(2):58-64,7.基金项目
河南省重点研发项目(241111233100) （241111233100）
